Technical Articles From Freescale Semiconductor Inc
Read technical articles about electronics manufacturing added by Freescale Semiconductor Inc
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1 technical article added by Freescale Semiconductor Inc
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Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs
Oct 16, 2014 | Rama Hegde, senior member of technical staff; Freescale Semiconductor.
Key points are:
*Long-term storage of BGA & QFP products may be required due to:
- Fab and assembly factory transfers
- Product obsolescence requiring customers make lifetime/EOL purchases
- Providing extended service (10+ years) on vehicles
- Other program needs
* Integrity of EOL products in terms of solderability needs to be verified....