Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1432 SMT / PCB Assembly Related Technical Articles

Cleaning High-power Electronics

Jan 06, 2009 | Steve Stach, Austin America; Harald Wack, Ph.D., Naveen Ravindran, Zestron America; Joachim Becht, Zestron Europe

To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary....

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas,

Consultant / Service Provider, Manufacturer, Training Provider

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

Jan 01, 2009 | Michael J. Rowlands and Vara Calmidi, Endicott Interconnect Technologiesogies

Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect. The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste....

Publisher: i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Five Myths of Reliability

Dec 23, 2008 | Dr. Nathan Blattau, Dr. Bob Esser, Dr. John McNulty, and James McLeish.

Myth 1: I don't worry about design, because most of my problems are with defects from suppliers......

Publisher: DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Consultant / Service Provider

Fuel Cell Production Revs Up. The Paste Printing Platform And Process Has Other Uses, Too.

Dec 18, 2008 | Clive Ashmore, Global Applied Process Engineering Manager; DEK.

Unless you've been living under a rock the past several years, you are no doubt keenly aware of the global drive toward alternative energy sources. Certainly this initiative is attractive because of the clear environmental benefits of developing fossil fuel substitutes, but also because of potential economic benefit. Although fuel cell technology has been proven viable for various applications, the production costs still remain relatively high, and further process development to promote low-cost, high-volume manufacturing is required to reach a price point that encourages widespread consumer acceptance....

Publisher: ASM Assembly Systems (DEK)

ASM Assembly Systems (DEK)

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Suwanee, Georgia, USA

Bromide-Free Options for Printed Circuit Boards

Dec 11, 2008 | Craig Hillman, PhD & Seth Binfield

Flame retardants have been around since the Egyptians and Romans used alum to reduce the flammability of wood. Brominated flame retardants (BFRs) first experienced use after World War II as the substitution of wood and metal for plastics and foams resulted in materials that were much more flammable. The widespread use of BFRs initiated in the 1970s with the explosion of electronics and electrical equipment and housings. For the US market, all of these products must conform to the UL 94 flammability testing specifications. In fact, the most common printed circuit board (PCB) in the electronics industry, FR-4, is defined by its structure (glass fiber in an epoxy matrix) and its compliance to UL 94 V0 standard....

Publisher: DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Consultant / Service Provider

Broadband Printing - A Paradigm

Dec 03, 2008 | Arun S. Ramasubramanian, Dr. Daryl Santos; Suny Binghamton.

This paper presents the analysis from a recent printing study employing a test vehicle that includes components such as 01005s to QFPs. In a recent publication, part of this study was presented focusing on 01005 printing only. This printing process was determined to be suitable for 01005s assembly and also analyzed based on statistical capability. The current paper will present the results from additional detailed analysis to determine if this process has the capability to provide sufficient solder paste deposits for larger components located on the same test board. In the future, the SMT industry may always look towards “Broadband Printing” as an alternative to dual stencil or stepped stencil printing technologies in order to meet the needs of both small and large components....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Advanced Electronic Connector Technologies

Nov 27, 2008 | Fred Verdi, Senior Manufacturing Engineer, ACI-EMPF.

Military electrical connectors have traditionally used very conservative design rules that provide the ruggedization needed for harsh military use environments. Commercial electronic connectors have typically used less conservative design rules that....

Publisher: Electronics Manufacturing Productivity Facility (EMPF)

Electronics Manufacturing Productivity Facility (EMPF)

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

Philadelphia, Pennsylvania, USA

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Nov 20, 2008 | Karl Seelig, David Suraski.

The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy....

Publisher: AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Meeting Heat And CTE Challenges Of PCBs And ICs

Nov 13, 2008 | Kris Vasoya,

The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB material. Thus it is necessary to have low CTE printed circuit boards in order to keep solder joint intact with such low CTE packages. There are currently several materials available in the market to address thermal and CTE challenges but each material has its own advantages and limitations......

Publisher: Stablcor

STABLCOR is an innovative Intellectual Property company that is dedicated to solving problems through design.

Costa Mesa, California, USA

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Nov 06, 2008 | Steven R. Martell, Ameya Mandlik and Kieren Mercer.

For many years Acoustic Micro Imaging (AMI) techniques have been utilized to evaluate the quality of the underfill used to support the solder bump interconnections of Flip Chip type devices. AMI has been established as one of the few techniques that can provide reliability and quality control data, but little has been done to automate the evaluation process for Flip Chip underfill until now....

Publisher: Sonoscan, Inc.

Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.

Elk Grove Village, Illinois, USA

Consultant / Service Provider, Manufacturer

Integrated Offset Placement in Electronics Assembly Equipment - The Answer for Solder Paste Misalignment

Oct 29, 2008 | Juki Corp.

Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand....

Publisher: Juki Automation Systems

Juki Automation Systems

Juki Automation Systems Inc. is one of the worlds leading SMT placement companies with over 45,000 machines installed worldwide and is the pioneer of the modular automated assembly line. see www.jukiamericas.com for more info.

Morrisville , North Carolina, USA

Flex Crack Mitigation

Oct 23, 2008 | Bill Sloka, Ceramic Technical Consultant, KEMET Corporation

As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing process have been systematically eliminated. Today these capacitor manufacturing-related defects are now at a parts per billion (PPB) level. Pareto analysis of customer complaints indicates that the #1 failure mode is IR failure due to flex cracks....

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville, South Carolina, USA

Advanced Solder Paste Dispensing

Oct 15, 2008 | Asymtek

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices....

Publisher: ASYMTEK Products | Nordson Electronics Solutions

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High-Speed Stamp Soldering

Oct 09, 2008 | Todd O’Neil.

This article examines stamp soldering, a solution that provides consistent high quality by repeatedly applying accurate amounts of molten solder onto a printed circuit board using static volumetric solder stamps guaranteeing total flatness during the through-hole soldering process....

Publisher: Juki Automation Systems

Juki Automation Systems

Juki Automation Systems Inc. is one of the worlds leading SMT placement companies with over 45,000 machines installed worldwide and is the pioneer of the modular automated assembly line. see www.jukiamericas.com for more info.

Morrisville , North Carolina, USA

An Alternative Dispense Process for Application of Catalyst Films on MEA's

Oct 01, 2008 | Horatio Quinones, Brian Sawatzky.

This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared....

Publisher: ASYMTEK Products | Nordson Electronics Solutions

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New Life for Aging Electronic Products

Oct 01, 2008 | Paul Nickelsberg, President and Senior Engineer, Orchid Technologies.

Many Original Equipment Manufacturers, (OEM’s), struggle to continue shipping aging or obsolete electronic products. Electronic products designed five to ten years ago are still relevant in the marketplace. Often these venerable old products have gained particular acceptance amongst a select group of customers. In many cases these old products fulfill a need in a unique manner. Examples include: designs that are grandfathered into an application due to regulatory considerations; designs having unique form-fit-and-function; designs running special software ; designs subject to contractual support and service requirements; designs in which a new contract stipulates delivery of older gear as part of a larger system offering. Any one or all of these reasons can lead an OEM to continue the production of electronic equipment well into its end of useful component life...

Publisher: Orchid Technologies Engineering & Consulting, Inc.

Orchid Technologies Engineering & Consulting, Inc.

Orchid develops custom electronic products for OEM's.

Maynard, Massachusetts, USA

Consultant / Service Provider, Manufacturer

Facedown Low-Inductance Solder Pad and Via Schemes

Sep 04, 2008 | John Prymak, Erik Reed, Allen Mayar

In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB....

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville, South Carolina, USA

Effect of Contact Time on Lead-Free Wave Soldering

Aug 28, 2008 | Jim Morris, Richard Szymanowski

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Lean Kitting: A Case Study

Aug 20, 2008 | Ranko Vujosevic, Ph.D. Optimal Electronics Corporation Jose A. Ramirez, Larry Hausman-Cohen, and Srinivasan Venkataraman The University of Texas at Austin Department of Mechanical Engineering Austin, Texas

Kitting is the first step in printed circuit board assembly. It is initiated well in advance of the actual production start to be able to prepare and deliver the kit on time. Kitting involves the gathering of all the parts needed for a particular assembly from the stockroom and issuing the kit to the manufacturing line at the right time and in the right quantity. This paper discusses kitting, describes ways to eliminate waste in different phases of kitting, and illustrates lean kitting using a case study conducted in a major contract manufacturer site....

Publisher: Optimal Electronics Corporation

Optimal Electronics Corporation

A global provider of innovative manufacturing execution system (MES) solutions for the electronics assembly industry.

Austin, Texas, USA

Consultant / Service Provider

XRF- A Reality Check

Aug 14, 2008 | Sia Afshari

The Restriction of Hazardous Substances (RoHS) regulations of the European Union, and similar regulations being enacted around the world, require the virtual elimination of lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6), polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) from electronic products. Allowable concentration levels in any homogeneous material contained within a product are extremely low: 0.01% for Cd and 0.1% for other substances by weight. The most significant issue affecting the practical validation of RoHS compliance in the day-to-day assembly environment is ensuring that no restricted substances, especially tin-lead (SnPb) materials, have inadvertently entered into the production stream....

Publisher: RMD Instruments

RMD Instruments

Since 1974 RMD has been providing innovative solutions across a broad range of security, medical and industrial applications, including radiation imaging and detection, nuclear instrumentation and non-destructive test equipment.

Watertown, Massachusetts, USA

Selection Of Wave Soldering Fluxes For Lead-Free Assembly

Jul 10, 2008 | Chrys Shea, Sanju Arora, Steve Brown

This paper reviews the J-STD-004 and how it is used in flux categorization and selection. It also discusses the major types of flux formulations available, and the design, process and reliability implications of using each type. The purpose of the paper is to help the reader make an informed choice when selecting wave solder fluxes for lead-free processing....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

Lead-Free Reliability - Building It Right The First Time

Jul 01, 2008 | Peter Biocca

As lead-free and RoHS compliancy fast approaches, it is more important than ever to build it right the first time. Lead-free assembly and RoHS will bring about numerous changes and the number of variables with which to contend is increasing, creating increased risk of defects and reduced product reliability. However, understanding what the variables are and their impact on the assembly can great increase product reliability....

Publisher: Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Printable Nanocomposites for Electronic Packaging

Jun 25, 2008 | Endicott Interconnect Technologies, Inc.

Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology....

Publisher: i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Enterprise-wide Supplier Quality Management: The Big Payoff for Global SPC

Jun 04, 2008 | Zontec Inc.

The convergence of a wide range of global influences is having a profound effect on current-day quality in manufacturing. Today's operational strategies must take into account business cycles, risk-based management, logistics, workflows, outsourcing, regulatory issues, product development, corporate mergers and acquisitions. In this ever-changing economy it is imperative that companies compete more effectively on two fronts: by reducing costs and emphasizing quality....

Publisher: Zontec, Inc.

SPC software manufacturer. Our software includes such extras as defect tracking, traceability, trend and root cause analysis, overall equipment effectiveness (OEE), rolled throughput yield (RTY), equipment uptime/downtime and supplier quality management in a true real-time production-based system.

Cincinnati, Ohio, USA

Consultant / Service Provider

Solder Paste Inspection Technologies: 2D-3D Correlation

May 28, 2008 | Rita Mohanty, Vatsal Shah; Speedline Technologies, Paul Haugen, Laura Holte; Cyber Optics Corp.

This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Flux Collection and Self-Clean Technique in Reflow Applications

May 14, 2008 | Speedline Technologies, Inc.

This paper will review some basic past and present flux chemistries that affect flux collection methodology. It will also review some of the most common flux collection methods, self-cleaning techniques, and maintenance goals. And, finally, data will be presented from high volume production testing of an advanced flux management system....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Printed Circuit Board Tracking with RFID: Speed, Efficiency and Productivity Made Simple.

May 07, 2008 | Chris Cook, Hank Tomarelli.

Tracking goods through manufacturing was originally accomplished with pencil, paper and human input. Barcodes introduced an automated, machine-readable tracking mechanism that streamlined all types of manufacturing. But modern printed circuit board (PCB) assemblies are running into limitations because of barcode labels. And though barcodes and RFID tags will co-exist, the relatively large barcode labels have to find increasingly scarce real estate on high density boards....

Publisher: Texas Instruments

Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. T

Dallas, Texas, USA

The Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity.

Apr 29, 2008 | David Hillman, Matt Wells, Kim Cho

The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies...

Publisher: Rockwell Collins

Rockwell Collins

Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications.

Cedar Rapids, Iowa, USA

Manufacturer, Other

Design Environment ROI: How Design Teams On A Budget Can Build A Best In Class Design Environment

Apr 22, 2008 | Nolan Johnson

Design workflow is the core to your design team's competitive advantage; it’s the conduit by which you turn your team's expertise and ideas into manufacturable products. And yet, all engineering teams face the challenge of maximizing their productivity within limited financial resources. How can the less-capitalized teams develop a design workflow that competes with the highly-capitalized teams? Simple: open tools....

Publisher: Sunstone Circuits

Sunstone Circuits

Sunstone Circuits offers a family of PCB Services to meet all of your PCB needs from design to delivery! We are trusted innovators in the marketing and manufacture of quickturn PCBs, design-checked boards, and design software.

Mulino, Oregon, USA

Laser Direct Imaging of Tracks on PCB Covered With Laser Photoresist

Apr 15, 2008 | R. Barbucha, M. Kocik, J. Mizeraczyk , 2, G. Kozioł, and J. Borecki, Polish Academy of Sciences

The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges....

Publisher: Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences

Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences

The mission of Unipress is to use high pressure methods for advanced fundamental research and technology development. The main fields: Solid state physics, Optoelectronics, Sintering of nanocrystalline materials...

Warsaw, Poland

Strength of Lead-free BGA Spheres in High Speed Loading

Apr 08, 2008 | Keith Sweatman, Shoichi Suenaga, Tetsuro Nishimura

Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension....

Publisher: Nihon Superior Co., Ltd.

Nihon Superior Co., Ltd.

Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.

Osaka, Japan

High Reliability Lead-free Solder SN100C?Sn-0.7Cu-0.05Ni?Ge?

Mar 31, 2008 | Satoshi Mizuta

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C....

Publisher: Nihon Superior Co., Ltd.

Nihon Superior Co., Ltd.

Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.

Osaka, Japan

Embedded Thermoelectric Cooling

Mar 25, 2008 | Jesko von Windheim, Nextreme Thermal Solutions

Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly methodology used to implement these devices is fully compatible with existing surface mount approaches. In order to take advantage of these unique characteristics, thin film thermoelectric devices need to be designed for the appropriate thermal and form-factor environments, with system-level constraints carefully considered as an integral part of the overall design process....

Publisher: Nextreme Thermal Solutions, Inc.

Nextreme Thermal Solutions, Inc.

Nextreme designs and manufactures manufactures micro-scale electronics cooling and energy harvesting solutions for telecommunications, semiconductor, consumer, medical, aerospace and government markets.

Durham, North Carolina, USA

Pin in Paste Stencil Design for Notebook Mainboard

Mar 18, 2008 | Atilim Demirtas, Vestel Digital

This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles....

Publisher: Vestel Electronic

Vestel Electronic

Presently,Vestel is the biggest TV manufacturer in Europe and increasing it's capacity year by year. As a OEM and ODM,we export our product every continent in the world.

Manisa, Turkey

Comparing Techniques for Temperature-Dependent Warpage Measurement

Mar 13, 2008 | Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer, Akrometrix.

Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique....

Publisher: Akrometrix

Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

Atlanta, Georgia, USA

Consultant / Service Provider, Manufacturer

Fundamentals of Solder Paste Technology

Mar 03, 2008 | Dosten Baluch, Gerard Minogue.

Solder pastes are key materials in surface mount technology (SMT) for assembly of printed circuit boards (PCBs). Introduction of lead-free has placed new demands on materials and processes in SMT, requiring materials and process engineers to adopt to lead free whilst ensuring process yields stay at the highest possible levels. Key is the solder paste, a material of great complexity involving engineering sciences, metallurgy, chemistry and physics. This article helps those working with solder pastes improve their understanding of this key material....

Publisher: BizEsp Ltd.

The company is currently in liquidation.

Oxford, United Kingdom

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Feb 26, 2008 | Michael J. Rowlands, Rabindra N. Das

More and more chip packages need multi-GHz RF structures to meet their performance targets. The ideal chip package needs to combine RF features with Digital features for these applications. They drive low-loss, controlled impedance transmission lines, flexibility in assigned signal and power layers, and clearances of various shapes in power layers. Building these features in a chip package is difficult without making the stack-up very thick or compromising the reliability of the product. In the present paper, we have designed and built a flip-chip package test vehicle (TV) to make new RF structures, using Z-axis interconnection (Zinterconnect) building blocks....

Publisher: i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Placement Optimisation in a Lean Manufacturing Environment

Feb 20, 2008 | Pierre Chatain, Europlacer Limited, Dorset, UK

Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques....

Publisher: EUROPLACER

Europlacer designs and manufactures a comprehensive range of highly flexible SMT pick and place equipment for the global electronics industry, with a network of distributors across the globe.

Poole Dorset, United Kingdom

Liquid Tin Corrosion and Lead Free Wave Soldering

Feb 12, 2008 | Jim Morris, Speedline Technologies, Matthew J. O’Keefe, Ph.D., University of Missouri

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

SnAgCuBi and SnAgCuBiSb Solder Joint Properties Investigations

Feb 05, 2008 | Kisiel R., Institute of Microelectronics and Optoelectronics; Bukat K. and Sitek J., Tele and Radio Research Institute; Gasior W., Moser Z. and Pstru_ J., Polish Academy of Sciences

This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb elements to the SnAgCu solders. The influence of added elements on the electrical and mechanical properties of solder joints created by these solders between PCB and electronic components were evaluated....

Publisher: Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences

Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences

The mission of Unipress is to use high pressure methods for advanced fundamental research and technology development. The main fields: Solid state physics, Optoelectronics, Sintering of nanocrystalline materials...

Warsaw, Poland

Optimizing Thermal and Mechanical Performance in PCBs

Feb 04, 2008 | Alex Mangroli, Kris Vasoya

Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums....

Publisher: Stablcor

STABLCOR is an innovative Intellectual Property company that is dedicated to solving problems through design.

Costa Mesa, California, USA

Selective Soldering Process

Jan 24, 2008 | Paul Bratt, Lead Package Engineer

Although many through-hole components are being replaced by their surface mount (SMT) counterparts, printed circuit boards (PCBs) are still being designed with both types of components. Often, there are interconnect hardware, displays, or other components that cannot withstand the exposure to the high temperature involved in the wave soldering process. They are generally soldered by hand. The challenge is to determine the optimal method manufacturers can use to solder these boards populated with mixed technology....

Publisher: Electronics Manufacturing Productivity Facility (EMPF)

Electronics Manufacturing Productivity Facility (EMPF)

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

Philadelphia, Pennsylvania, USA

Quieting the Noise: Quality Wave Soldering Depends on Control of Its Many Parameters.

Jan 24, 2008 | Gerjan Diepstraten, Senior Process Engineer, Vitronics Soltec BV

The wave solder process is characterized by a large number of process parameters. To understand them all and their interactions is challenging, particularly when it comes to lead-free soldering. Wave soldering has a number of sub-processes, which include fluxing, preheating, soldering and cooling....

Publisher: Vitronics Soltec

Vitronics Soltec

Global manufacturer of XPM Reflow Ovens, ZEVA Selective Soldering and Delta Wave Soldering Equipment.

Camdenton, Missouri, USA

Process Development And Characterization Of The Stencil Printing Process For Small Apertures

Jan 16, 2008 | Dr. Daryl Santos, SUNY Binghamton; Dr. Rita Mohanty, Speedline Technologies

The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Lead-free Wave Soldering of Simple to Highly Complex Boards. Process Optimization

Jan 10, 2008 | Denis Barbini, Vitronics Soltec; Paul Wang, Microsoft; Peter Biocca, ITW Kester; Quyen Chu, Jabil

This research takes an in-depth look at the challenges encountered in developing a lead free wave soldering process based on the specific products as well as on specific materials. It attempts to provide the reader with the information necessary to make educated decisions in selecting materials and controlling various process parameters in order to execute a rational implementation strategy for a reliable and robust lead free wave soldering process....

Publisher: Vitronics Soltec

Vitronics Soltec

Global manufacturer of XPM Reflow Ovens, ZEVA Selective Soldering and Delta Wave Soldering Equipment.

Camdenton, Missouri, USA

Developing a Reliable Lead-free SMT Process

Jan 03, 2008 | Peter Biocca, Senior Development Engineer, Kester.

Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C....

Publisher: Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Lean, Mean Dual-Lane Machines

Dec 27, 2007 | DEK

The latest screen printing platforms unlock more of the potential from dual-lane processing. Simultaneous demands to enhance flexibility while increasing utilisation and overall throughput apply to manufacturers operating at virtually any point in the mix-volume continuum: capacity must work hard to deliver the required return. As these lean manufacturing principles hold sway from the US and Europe to the Far East, no modern assembler has a second to spare....

Publisher: ASM Assembly Systems (DEK)

ASM Assembly Systems (DEK)

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Suwanee, Georgia, USA

Reflow Profiling: Time Above Liquidus

Dec 20, 2007 | David Suraski

Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often associated with profiling can be reduced if there is a strong understanding of the variables that can be encountered during the reflow process, as well as the metallurgical dynamics of the soldering process. This paper shall provide a brief outline of the reflow profile in general, with specific emphasis placed upon the suggested time spent above the melting temperature of the solder. The guidelines for soldering to various surfaces and with alternative solder alloys also are discussed....

Publisher: AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Dec 13, 2007 | Steve Watkin, Semicon Packaging Technologies Division, and Tom Falcon, Future Technologies Group, DEK

Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies....

Publisher: ASM Assembly Systems (DEK)

ASM Assembly Systems (DEK)

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Suwanee, Georgia, USA

Lead-Free Solder Wafer Bumping

Dec 06, 2007 | Fred Dimock, Kristen Mattson.

Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition....

Publisher: BTU International

BTU International

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

North Billerica, Massachusetts, USA

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