Technical Articles From Tessera Technologies
Read technical articles about electronics manufacturing added by Tessera Technologies
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1 technical article added by Tessera Technologies
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Assembly Process Development for Chip-Scale and Chip-Size μBGA™
May 09, 1999 | Vern Solberg.
This paper will review chip-scale and chip-size package variations, solder alloy options, furnish guidelines for solder stencil development and outline the actual processes used to successfully produce SMT assemblies utilizing CSP technology. ...
