Technical Articles From Photo Stencil LLC
Read technical articles about electronics manufacturing added by Photo Stencil LLC
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3 technical articles added by Photo Stencil LLC
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Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Nov 05, 2015 | Rachel Miller Short, William E. Coleman Ph.D.; Photo Stencil | Joseph Perault; Parmi.
There has been recent activity and interest in Laser-Cut Electroform blank foils as an alternative to normal Electroform stencils. The present study will investigate and compare the print performance in terms of % paste transfer as well the dispersion in paste transfer volume for a variety of Electroform and Laser-Cut stencils with and without post processing treatments. Side wall quality will also be investigated in detail. A Jabil solder paste qualification test board will be used as the PCB test vehicle....
Electroformed vs. Laser-cut: A Stencil Performance Study
Jan 11, 2013 | By Michael R. Burgess and William E. Coleman, Ph.D., Photo Stencil
There have been claims in the industry that laser-cut electroformed nickel foil blanks provide stencil print performance comparable to electroformed stencils. A study was established to measure the quantitative differences in performance between the two during an independent lab study....
Stencil Printing of Small Apertures
Oct 25, 2012 | William E. Coleman Ph.D.
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper will examine stencil technologies (including Laser and Electroform), Aperture Wall coatings (including Nickel-Teflon coatings and Nano-coatings), and how these parameters influence paste transfer for miniature devices with Area Ratios less than the standard recommended lower limit of .5. A matrix of print tests will be utilized to compare paste transfer and measure the effectiveness of the different stencil configurations. Area Ratios ranging from .32 to .68 will be investigated....
