Technical Articles From Auburn University

Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders

Feb 16, 2017 | Thomas Sanders, Sivasubramanian Thirugnanasambandam and John Evans, Ph.D., Michael Bozack, Ph.D., Jeff Suhling, Ph.D. - Auburn University, Wayne Johnson, Ph.D. - Tennessee Tech University

This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.

This paper was originally published by SMTA in the Proceedings of SMTA International....

SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing

Aug 04, 2011 | William Edward Swaim

This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and ...

Assessment of Residual Damage in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling

Oct 21, 2010 | Pradeep Lall, Rahul Vaidya, Vikrant More, Kai Goebel, Jeff Suhling

Electronic systems are often stored for long periods prior to deployment in the intended environment. Aging has been previously shown to effect the reliability and constitutive behavior of second-level leadfree interconnects....