Technical Articles From Lamar University - Department of Mechanical Engineering
Read technical articles about electronics manufacturing added by Lamar University - Department of Mechanical Engineering
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1 technical article added by Lamar University - Department of Mechanical Engineering
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Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures
Jan 12, 2012 | Ronak Varia, Xuejun Fan
In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi...
