Technical Articles From Johns Hopkins Applied Physics Laboratory
Read technical articles about electronics manufacturing added by Johns Hopkins Applied Physics Laboratory
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1 technical article added by Johns Hopkins Applied Physics Laboratory
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Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
Aug 16, 2012 | David M. Lee, Lesly A. Piñol, PhD
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu...
