Test Research (TRI) TRI TR7700SIII 3D AOI
Model: |
Test Research (TRI) TRI TR7700SIII 3D AOI |
Category: |
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Condition: |
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Location: |
China |
Offered by: |
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Contact Goldland Electronic Technology Company Limited |
Product description:
Optical System
Imaging Method Dynamic Imaging with true 3D profile measurement
Top Camera 4 Mpix
Angle Camera N/A
Imaging Resolution 10 µm, 15 µm (factory setting)
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors
Max. 3D Range 20 mm
Inspection Performance
Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*
* Depending on board size and laser resolution
Motion Table & Control
X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm
Board Handling
Max PCB Size TR7700 SIII 3D: 510 x 460 mm
TR7700L SIII 3D: 660 x 460 mm
TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm [5 mm optional]
Conveyor Inline
Height: 880 – 920 mm
* SMEMA Compatible
Inspection Functions
Component Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component
Solder Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
Dimensions
WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm
TR7700L SIII 3D: 1300 x 1630 x 1655 mm
TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
Weight TR7700 SIII 3D: 1030 kg
TR7700L SIII 3D: 1250 kg
TR7700 SIII 3D DL: 1150 kg