PARMI HS70 3D Solder Paste Inspection Machine (2011)
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PARMI HS70 3D Solder Paste Inspection Machine (2011) |
Category: |
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Model Year: |
2011 |
Condition: |
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Location: |
Texas, USA |
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PARMI HS70 3D Solder Paste Inspection Machine (2011)
Brand: Parmi
Model: HS70 Solder Paste Inspection Machine
Serial #: H7S0
Year: 2011
Machine Specifications:
Software Version: Parmi 3D SPI v1.5.1.2
Conveyor Inspection Program: Single Lane 1 stage conveyor
System Diagnosis Up/down stream Interface:SMEMA II
Measurement:
Measuring Principle: Shadow free Dual Laser Optical Triangulation
Inspection Type: Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink
Camera Type RSC VI Specifications:
X-Y Resolution: 18x9 j/m
Height Resolution: 0.1 j/m
Max. Paste Height & Size: 1000 mm / 20x20 mm
Min. Paste Size & Pitch: 150x150 mm / 100 mm
Inspection Speed: 80 sg.cm/sec
Height Accuracy: 2 mm. on a certification target
Height Repeatability: 3 Sigma ( 1 mm, on a certification target
Area Repeatability: 3 Sigma ( 1%, on a certification target
Volume Repeatability: 3 Sigma ( 1%, on a certification target
Board Specification:
Gage R&R Maximum & Minimum Board Size: « 5 % - 430 x350
Maximum Board Warp: ±5 mm
Board Thickness: 0.4 to 4 mm
Board Edge Clearance (TOP/Bottom): 2.5/4mm
Underside Clearance: 23 mm
System Dimensions:
Dimensions (WxDxH): 970 x 1195 x 1535 mm
Weight: 800 kg
Conveyor Height: 890 - 965 mm [SMEMA]
Load, Unload Time: 3.0 sec
Flow Direction: Left-Right or Right-Left (Automatic)(Optional)
Hardware System:
Conveyor Width Adjusting X-Y-Z robot: Auto Adjustable - Sensor head move in X-Y-Z axis
Computer: Pentium IV Quad Core, 8GB Memory, MS-Windows XP Professional 64bit
Power Supplies: Electric - AC 220V, 50/60 Hz, Pneumatic - 5Kgf/sq cm
Company Information:
