Mirtec MS-11 3D Solder Paste Inspection

Model:	Mirtec MS-11 3D Solder Paste Inspection
Category:	SPI / Solder Paste Inspection
Model Year:	2011
Condition:	used
Location:	South Carolina, USA
Offered by:	LEL Tech
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Mirtec MS-11 3D Solder Paste Inspection SPI (2011)
Model: MS-11
Vintage: 2011
Qty Available: 2
2D Phase Step Image Processing
High Speed Precision In-Line SPI System
Four Mega Pixel Digital Camera Technology
Precision Telecentric Compound Lens Design
10 Micron / Pixel Resolution
2 Micron Height Accuracy
Volume Repeatability +/- 2%
Advanced Dual Probe Shadow Free Design
Superior Solder Profile Characterization
Three Stage High Speed Conveyor System
Automatic Gerber Import Software
Max PCB Size: 20.1” x 18.1”
Min PCB Size: 2.0” x 2.0”
Complete & Operational