The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 29, 2011. Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed below.
2012 Pan Pacific Microelectronics Symposium topics include:
- 3D/Heterogeneous Integration
- Emerging Technologies
- Green Electronics
- High Performance Low I/O
- Material Advances
- Reliability
- Health/Prognostics
- Strategic Direction/Industry Roadmaps
Please submit abstracts of 500 words with title and author contact information to JoAnn Stromberg, joann@smta.org, or online at http://smta.org/panpac/call_for_papers.cfm.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.