Company Information:
Jan 22, 2015 | Indium Corporation announces that several company technologists have earned their designation as SMTA-Certified Process Engineers, further expanding the largest SMTA-certified engineering team in the industry.
Jan 20, 2015 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.
Jan 15, 2015 | Indium Corporation's Kenneth Thum, senior technical support engineer, and Nguyen Viet Truong, assistant technical manager for Asia Pacific operations, will present at the upcoming IPC Conferences on Assembly and Reliability in Vietnam and Thailand.
Jan 13, 2015 | Indium Corporation's Eric Bastow, assistant technical manager, will present at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif. Bastow's presentation, Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?, explores the electrical reliability of two no-clean solder pastes stored under various conditions and aged over different time intervals.
Jan 06, 2015 | Indium Corporation's Graham Wilson, applications engineer, will present at the IMAPS France Workshop on Thermal Management in La Rochelle, France, on Feb. 5, 2015.
Dec 04, 2014 | Indium Corporation announces that Tim Hults, technical support engineer for global accounts, has achieved the designation of SMTA-Certified Process Engineer.
Nov 04, 2014 | Indium Corporation's Ed Briggs, senior technical support engineer, will present at the SMTA Space Coast and Tampa Bay Expo & Tech Forum on Dec. 4 in Kissimmee, Fla.
Oct 29, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, delivered a keynote presentation at the Electronics Packaging Symposium at Binghamton University on Oct. 8. Indium Corporation's Dr. Weiping Liu, research metallurgist, also presented at the symposium.
Oct 23, 2014 | Indium Corporation's Aaron Yan, area technical manager - eastern China, will share his expertise at an IPC Seminar on Oct. 29 in Suzhou, China. Yan's presentation, The Challenge of Solder Paste Application in the Mobile Communication Industry, will discuss the solder paste requirements to address the component miniaturization trend, halogen-free flux activity level demands, and the continuing demand for reliable low-cost, Pb-free alloys.
Oct 21, 2014 | Indium Corporation, Kyzen Corporation, Heller Industries and MBtech Group hosted a technical conference on Oct. 17 in Melaka, Malaysia.
Oct 14, 2014 | Indium Corporation's Greg Wade, global technical support engineer, will share his expertise at the LaserJob Technology Forum on Nov. 6 in Furstenfeld, Germany.
Oct 08, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the 11th Annual International Wafer-Level Packaging Conference (IWLPC) Nov. 11-13 in San Jose, Calif. Dr. Lee's tutorial, Achieving High Reliability Lead-Free Soldering - Materials Considerations, will take place Nov. 13 from 1:30-5:00 p.m.
Oct 08, 2014 | Indium Corporation's Liyakathali Koorithodi, assistant technical manager, presented at IPC India on Sept. 24.
Sep 23, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan. Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys.
Sep 11, 2014 | Indium Corporation's Pony Liao, area technical manager for Northern China, presented at the IPC Shenyang Seminar in August in Shenyang, China. Liao's presentation, Indium's Advanced Technology and Materials, discussed benefits of three recent innovations in electronics assembly materials:
Sep 10, 2014 | Indium Corporation announces the release of a revolutionary new product called EZ-Pour™ Gallium Trichloride (GaCl3).
Sep 04, 2014 | Indium Corporation's Wolfgang Bloching, regional sales manager for Germany, Austria, and Switzerland, will present at Yamaha Technology Day on Oct. 1 in Neuss, Germany.
Sep 03, 2014 | Indium Corporation recently relocated its Shenzhen office to a larger facility at, West Tower, Qiushi Center, Room 1701, Zhuzlin, ShenNan Road Central, Futian District, Shenzhen, PRC. The move addresses the sales team’s need for additional space due to increased staffing.
Aug 27, 2014 | Indium Corporation's Karthik Vijay will present The Effect of Reflow Profiling on the Electrical Reliablity of No-Clean Solder Paste Flux Residues at the SMART Group's seminar, Reliability and Standards in Real Life: An IPC and SMART Group Perspective.
Aug 26, 2014 | Indium Corporation technology experts will share their expertise at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif.
Aug 20, 2014 | Indium Corporation's Sehar Samiappan, area technical manager for North Malaysia, the Philippines, and Vietnam, will present at the SMTA Penang Chapter's meeting on Aug. 21.
Aug 14, 2014 | Several Indium Corporation experts will share their technical knowledge with attendees at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
Aug 13, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the 2014 China Solder Technology Forum and Exhibitions (CSTF) Aug. 26-27 in Shenzhen, China.
Aug 12, 2014 | Indium Corporation's Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen, China.
Aug 07, 2014 | Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.
Aug 06, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.
Aug 06, 2014 | Indium Corporation announces that Andy C. Mackie, Ph.D., MSc, has been named president of the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS).
Aug 05, 2014 | Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Aug 05, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on Monday, September 29 in Rosemont, Ill.
Jul 31, 2014 | Indium Corporation announces that Brian Reid has joined the company as vice president of operations.
Jul 30, 2014 | Indium Corporation announces that Jason Chou has been hired as the area technical manager for Taiwan. In this role, Chou will provide technical support to Indium Corporation’s customers in Taiwan, with a focus on the semiconductor industry.
Jul 29, 2014 | Several Indium Corporation technology experts will lead technical sessions at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
Jul 24, 2014 | Indium Corporation's Pat Ryan, America's sales manager, will share his technical knowledge at Techni-Tool’s biannual sales meeting on July 27 in Blue Bell, Pa.
Jul 09, 2014 | Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.
May 29, 2014 | Indium Corporation's Assistant Technical Manager Liyakathali Koorithodi will present at the SMTA India chapter's quarterly meeting on May 30 at Sathyam Group Resorts in Sriperumbudur, India.
May 28, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the International Union of Materials Research Societies - International Conference on Electronic Materials (IUMRS-ICEM) from June 10-14 at Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.
May 22, 2014 | Indium Corporation's Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
May 15, 2014 | Indium Corporation and Kyzen hosted a technical seminar on April 29 in Hsinchu, Taiwan. The seminar featured presentations by Sze Pei Lim, Indium Corporation’s technical manager for Southeast Asia, and Jason Chan, Kyzen’s technical applications manager. Each presented on a variety of topics, including low temperature alloys, cleaning semiconductor devices, and new technologies.
May 14, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and Technology Conference (ECTC) May 27-30 in Lake Buena Vista, Florida.
May 13, 2014 | Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
May 07, 2014 | Indium Corporation technology experts will present at the IPC Southeast Asia High Reliability Conference May 28 in Singapore.
May 06, 2014 | Indium Corporation's Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.
May 05, 2014 | Indium Corporation technology experts will present at PCIM Europe May 20-22 in Nuremberg, Germany.
Apr 30, 2014 | Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.
Apr 30, 2014 | Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Apr 18, 2014 | Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass.
Apr 10, 2014 | Indium Corporation's Greg Wade, technical support engineer - global accounts, will present at the regional SMTA expo in Boise, Idaho on April 17.
Apr 08, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the International Workshop on WGB Power Electronics April 10-11 in Hsinchu, Taiwan. Dr. Lee will present The Status and Prospect of Silver Sintering Paste Development. This presentation will discuss the significance of silver sintering paste for high power semiconductor devices and its future potential .
Apr 03, 2014 | Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.
Apr 02, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia.