News Releases from Indium Corporation

Read Indium Corporation company news

SMTnet
»
News
»
News Contributors
»
News Releases from Indium Corporation

357 news releases added by Indium Corporation

Company Information:

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer

315-853-4900
315-853-1000

See Company Website »

Company Postings:

(10) products in the catalog

(27) technical library articles

(357) news releases

Indium Corporation Employees Receive IPC Certification

Mar 03, 2010 | Indium Corporation announces that 20 of its employees from R&D, Technical Support and Applications Development received their certification in IPC-A-610D, Acceptability of Electronic Assemblies.

Indium Corporation’s Technical Support Engineer to Present at Sustainability Summit

Nov 01, 2009 | Indium Corporation’s Director of Metals & Chemicals, Claire Mikolajczak, is presenting at the Sustainability Summit 3-5 November in Milan, Italy.

Indium Corporation’s Director to Present at Sustainability Summit

Nov 01, 2009 | Indium Corporation’s Director of Metals & Chemicals, Claire Mikolajczak, is presenting at the Sustainability Summit 3-5 November in Milan, Italy.

Indium Corporation’s Technical Manager to Present at the SMART Group’s 25th Anniversary Seminar

Oct 22, 2009 | Indium Corporation’s Technical Projects Manager, Mike Fenner, is presenting at the SMART Group’s 25th Anniversary Seminar on 22 October 2009 at the Oxfordshire Golf Club, Thame, Oxfordshire.

Indium Corporation Acquires Assets of Reactive NanoTechnologies

Sep 26, 2009 | Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.

Indium Corporation's Sbiroli Receives IPC's Distinguished Committee Service Award

May 26, 2009 | Indium Corporation's Dave Sbiroli, Applications Development Program Manager, was presented with the IPC Distinguished Committee Service Award at APEX 2009 in Las Vegas, Nevada.

Indium Corporation's Dr. Lee Recognized by Two Industry Organizations

May 20, 2009 | Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, was recognized recently by two highly respected industry organizations as both a Distinguished Author and Distinguished Lecturer.

Indium Corporation's Dr. Lee to Present at ECTC

May 13, 2009 | Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present the paper, �Achieving High Reliability, Low Cost, Lead-Free SAC Solder Joints Via Mn or Ce Doping� at the 59th Electronic Components and Technology Conference (ECTC) held in San Diego, CA, May 26 - 29, 2009. He will also chair the professional development course, �Achieving High Reliability of Lead-Free Soldering � Materials Consideration� at the conference.

Indium Corporation Appoints Foundation Technologies as Sales Representative for Ohio

Mar 06, 2009 | Under the newly formed business of Foundation Technologies, Barry O'Brien remains the sole representative for Indium Corporation in Ohio. Based in Cleveland, Ohio, Foundation Technologies is responsible for selling Indium Corporation's full line of solder paste, solder wire, wave fluxes, rework fluxes, solder preforms, solder spheres, solder ribbon and foil.

Indium Corporation's Sales Engineer to Present at SMTA San Diego Chapter Meeting

Mar 05, 2009 | Indium Corporation's Karthik Vijayamadhavan is schedule to present at the chapter meeting for the San Diego Surface Mount Technology Association (SMTA) on March 11, 2009.

Indium Corporation's Socha Promoted to Manager of Applications Engineering

Feb 21, 2009 | Indium Corporation announces that Paul Socha has been promoted to Manager of Applications Engineering. Paul is based at Indium's global headquarters in Clinton, NY, USA.

Indium Corporation Technical Engineers' Papers Accepted by IPC Lead-Free Conference

Feb 15, 2009 | Indium Corporation's Senior Technical Support Engineer Mario Scalzo and Technical Support Engineer Ed Briggs had their papers accepted for presentation at the IPC/JEDEC Conference, Transitioning to Lead Free � Strategies for Implementation, in Santa Clara, California, March 3-5, 2009. Both Mario and Ed are based at Indium's global headquarters in Clinton, NY.

Indium Corporation Features New Halogen-Free Pb-Free Solder Paste at APEX

Feb 11, 2009 | ndium8.9HF Solder Paste is a halogen-free Pb-free solder paste with unsurpassed print transfer efficiency and response-to-pause printing. The advanced rheology of Indium8.9HF is ideally suited for today's advanced 0.4mm pitch and 0201 technologies.

Indium Corporation's Dr. Lee to Present at Pan Pacific Microelectronics Symposium

Jan 21, 2009 | Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers, A Novel Flexible Ag (Silver) Paste and Next Level Requirements for Ultra Fine Pitch Printing, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, February 10-12, 2009.

Indium Corporation's Giasone Promoted to Metals Manager

Dec 15, 2008 | Indium Corporation announces the promotion of Emily Giasone to Metals Manager for the Metals, Chemicals, and Energy (MCE) Business Unit.

Indium Corporation Expands Sales Network in Florida

Oct 13, 2008 | Indium Corporation has named the EMC3 Group as its newest sales channel partner. The EMC3 Group will focus primarily on selling Indium Corporation's PCB assembly products in Florida, including solder paste, cored wire, wave flux, solder bar, rework fluxes, preforms, spheres, ribbon, and foil.

Indium Corporation Promotes McKee to Support European Sales Region

Oct 07, 2008 | Indium Corporation announces the promotion of David McKee to the position of Key and Direct Accounts Manager for Indium Corporation in Europe.

Indium Corporation Technology Experts to Participate at IWLPC

Oct 01, 2008 | Two of Indium Corporation's technology experts will be participating in the International Wafer-Level Packaging Conference (IWLPC), October 13-16, 2008 in San Jose, CA: Semiconductor Packaging Materials Product Manager, Andy C. Mackie, Ph.D. and Applications Engineer Jim Hisert.

Indium Corporation's Seager Promoted to SCP Manager

Aug 22, 2008 | Indium Corporation announces the promotion of Andy Seager to the position of Sales Channel Partner Manager.

Indium Corporation Expands Sales Network in Western USA

Aug 14, 2008 | Recht Associates now sells Indium Corporation's Thermal Interface Materials (TIM) � solder TIMs, non-reflow products, compressible TIM Heat-Spring�, liquid metal, and burn-in TIM.

Meet the Indium Corporation Bloggers @ SMTAI

Aug 14, 2008 | Indium Corporation's industry leading electronics assembly bloggers are hosting a Meet the Bloggers session on Wednesday, August 20, 2008 at Indium Corporation's SMTAI exhibit booth #517 at 11:00am EST.

Indium Corporation Announces Promotions

Aug 11, 2008 | Indium Corporation recently announced the promotion of three individuals - all based at Indium's headquarters in Clinton, NY.

Indium Corporation Expands Solar Engineering Team

Aug 11, 2008 | Indium Corporation has announced the expansion of its solar engineering team with the appointment of Clark Scharett and Justin Weiler as Manufacturing Process Engineers. Clark is based at Indium's new facility in the Utica Business Park, Utica, NY, and Justin is based at Indium's Robinson Road manufacturing facility in Clinton, NY.

Indium Corporation Expands Sales Network in Western USA

Jun 19, 2008 | Indium Corporation has named Powell Industries, Inc. as its newest sales channel partner.

Indium Corporation Announces Promotion

Jun 16, 2008 | Indium Corporation announces the appointment of Greg Hayes to the position of Southeastern USA Regional Sales Manager.

Indium Corporation Announces Promotion

May 06, 2008 | Indium Corporation announces the promotion of Karl Pfluke to the position of Senior Account Manager for the Metals & Chemicals Business Unit. He is responsible for sales in North America, with primary focus on the solar energy market. He reports to the Director of Sales for Metals and Chemicals, David Preische.

Indium Corporation Features New Probe-Testable Solder Paste at APEX

Feb 28, 2008 | Indium8.9 Pb-Free Solder Paste is an air reflow no-clean solder paste that prints perfectly every time.

Indium Corporation's Chicago Materials Division Earns ISO-9001:2000 Certification

Feb 22, 2008 | Indium Corporation�s Chicago Materials Division recently passed its ISO-9001:2000 certification audit. Indium�s newest facility joins the company�s US, English, Chinese, and Singapore operations in achieving ISO-9001:2000 certification.

Indium Corporation Presents Award to Zen Voce

Feb 20, 2008 | Indium Corporation�s Semiconductor Packaging Materials team presented their Equipment Partner of the Year Award to Zen Voce. The award, presented in Singapore, was given to Zen Voce�s General Manager, Mr. Jeffrey Mah, by Indium�s Managing Director for Asia-Pacific Operations, Pang Weng Fai.

Indium Corporation�s Technology Experts Presenting at APEX

Feb 03, 2008 | Three of Indium Corporation�s technology experts will be presenting at APEX, IPC Printed Circuits Expo March 29 -April 3, 2008: Vice President of Technology, Dr. Ning-Cheng Lee; Senior Technologist, Dr. Ronald C. Lasky, Ph.D.; and Solder Paste Product Manager, Tim Jensen.

Indium Corporation Asian SMT Workshop Series Features Dr. Ning-Cheng Lee

Jan 08, 2008 | Indium Corporation�s Vice President of Technology, Dr. Ning-Cheng Lee, will present workshops in Bangkok, Thailand; Penang, Malaysia; and Chennai, India, in January 2008.

Indium Corporation VP Presents at Pan Pacific Microelectronics Symposium

Dec 27, 2007 | Indium Corporation�s Vice President of Solder Products Business Unit, Ross Berntson, will present a workshop on �Full Metal TIMs� at the Pan Pacific Microelectronics Symposium & Tabletop Exhibition in Kauai, Hawaii on 22-24 January 2008.

Indium Corporation�s Corporate Communications Director Earns SMTA Award

Oct 30, 2007 | Indium Corporation�s Director of Corporate Communications, Rick Short, was honored with the Excellence in International Leadership Award by the Surface Mount Technology Association (SMTA) on October 10th, 2007. This award recognizes Rick�s global achievements in the industry and his support of the SMTA over his career of nearly 25 years.

Indium Corporation Features Ultra-Low Voiding Solder Paste at Productronica

Oct 23, 2007 | Indium Corporation�s *Indium5.1AT Pb-Free Solder Paste *is an Award-Winning No-Clean, Pb-Free Solder Paste that delivers enhanced finished goods reliability by featuring;

Indium Corporation Announces New Sales Channel for Eastern North America

Oct 11, 2007 | Indium Corporation has named Simcona Electronics Corporation as its newest sales channel partner. Simcona covers the eastern part of North America from Montreal to Miami, focusing primarily on distribution of solder bar, flux-cored wire, and wave solder fluxes.