Apr 08, 2008 The Slic-Blade surface is very smooth and slick, eliminating the issue of solder paste sticking to the blade. There is less bridging, reduced paste shear breakdown and faster print speeds when using this product. Additionally, the smooth surface reduces solder paste shearing against the blade surface, eliminating viscosity breakdown and rheology changes in the solder paste.
The Slic-Blade is solid nickel and will not chip or flake as coated blades do. This allows the Slic-Blade to be re-sharpened when it becomes dull. Although, only periodic sharpening is needed to keep the Slic-Blade operating at its maximum efficiency. Squeegee blade sharpness and angle of attack are significant factors that influence the printing speed of solder paste. Due to the sharpness of the squeegee blade, less pressure is required to thoroughly wipe the stencil, resulting in an increase in printing speed.
The Slic-Blade has enhanced stencil life and the least stencil damage compared to competitors, resulting in the longest stencil life on the market today. Longer stencil life reduces cost and amount of scrap.
Now in its 16th year, the SMT VISION Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology in 16 key areas are chosen by a distinguished panel of industry experts.
