Company Information:
Jun 07, 2013 | The Counterfeit Components Project of the International Electronics Manufacturing Initiative (iNEMI) today released a whitepaper entitled, "Development of a Methodology to Determine Risk of Counterfeit Use."
May 23, 2013 | The Counterfeit Components Assessment Project of the International Electronics Manufacturing Initiative (iNEMI) will hold two open webinars to help the electronics manufacturing supply chain better manage their risk of counterfeit components.
May 14, 2013 | Cloud computing, sustainability & recycling, and the explosive growth of MEMS & sensors are among leading trends
Feb 06, 2009 | Input will help the electronics industry improve test implementation and coverage
Apr 23, 2008 | European workshop scheduled for 18 June at IMEC in Leuven, Belgium
Mar 24, 2008 | North American workshop is May 14
Nov 13, 2007 | Photo available (see note at end of release)
Nov 02, 2007 | Book provides in-depth information for implementing
Jan 15, 2007 | Forum on lead-free processes and summit on reliability are also planned
Nov 08, 2006 | Workshop Scheduled for January 24 in Silicon Valley
Sep 08, 2006 | iNEMI and IPC sponsor event to discuss emerging environmental regulations
Sep 07, 2006 | A broad range of topics will be covered
Jun 23, 2006 | Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
May 04, 2006 | Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
May 04, 2006 | Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
May 04, 2006 | Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
Apr 17, 2006 | Event co-sponsored by iNEMI, the IEEE CPMT Society and ECTC
Jan 18, 2006 | Open meeting at APEX 06
Sep 07, 2005 | Sun Microsystems to Host Oct 4 Meeting
Aug 31, 2005 | EIA and SIA Co-Sponsor the Event
Jan 24, 2001 | The NEMI issued an industry-wide call for participation for a new project the organization is proposing to accelerate the convergence of competing approaches for CAD data exchange formats used by the electronics industry. Through this project, industry participants will leverage the strengths of existing standards (i.e., GenCAM, IPC-2578) and solutions (i.e., ODB++) to recommend a common course of action for future standards work through the well-established process of IPC.