News Releases from Siemens Process Industries and Drives
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71 news releases added by Siemens Process Industries and Drives
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SIPLACE Setup Center now with MSD option
Aug 04, 2009 | As components get smaller and smaller, managing moisture-sensitive devices and protecting them across the entire supply chain is becoming increasingly important for electronics manufacturers. The goal is to prevent the use of moisture-damaged components at the very start of the SMD process chain.
SIPLACE SX: Countless requests for value analyses
Aug 04, 2009 | Even perfectly synchronized production environments have room for improvements, which are often not addressed when bottlenecks loom and the production capacity is fully utilized. That’s why innovative electronics manufacturer use the current global order decline to subject their production floors to a thorough checkup in order to identify potential development and optimize processes.
Siemens in India inaugurates their first SIPLACE Training Center at Bangalore
May 29, 2009 | Siemens is taking another step into the fast growing SMT (Surface Mount Technology) industry in India. The launch of the first SIPLACE training demo centre at the Nettur Technical Training Foundation (NTTF), in Bangalore reflects Siemens' enterprising response to the rapidly changing market requirements.
Constantly high level of line productivity and automatic adaptation to new products with the SIPLACE X-Series powered by the SIPLACE MultiStar CPP head
May 29, 2009 | SIPLACE reference lines equipped with the new MultiStar CPP head deliver a continuous high level of line productivity, especially in high-mix production environments.
New development from the SIPLACE Technology Network - The new SIPLACE CA application: Die-bonding and SMD placement in a single machine
May 29, 2009 | Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
SIPLACE Feeder Care
May 14, 2009 | Professional support for in-house maintenance
SIPLACE Feeder Care: Professional support for in-house maintenance
May 06, 2009 | To maximize their placement quality and speed, electronics manufacturers must keep their feeders in top condition. With the SIPLACE Feeder Care Solutions 2009, a newly developed maintenance concept, technology leader Siemens Electronics Assembly Systems now offers electronics producers the facility to significantly reduce their feeder maintenance costs.
High-speed on-demand electronics production finally becomes reality with the new SIPLACE SX
May 06, 2009 | With the SIPLACE SX, Munich-based technology leader Siemens Electronics Assembly Systems (SEAS) introduces a placement machine that opens the door to totally new manufacturing concepts and delivers significantly more efficiency in response to increasingly frequent product changeovers and massive demand fluctuations.
SIPLACE innovations successful at trade and technology shows
May 06, 2009 | The presentations of technology leader Siemens Electronics Assembly Systems (SEAS) at regional trade shows like APEX in Las Vegas, Nepcon in Shanghai and SMY/Hybrid/Packaging in Nuremberg, Germany confirm that the company has set the right course for the future.
SIPLACE at the SMT Hybrid&Packaging in Nuremberg: SIPLACE breaks new grounds in electronics manufacturing
Apr 27, 2009 | In difficult times like these, marketing budgets in general and trade show budgets in particular are often subject to particularly close inspection and analysis, which leads to questions such as �Why don't we save the money it costs to be present at trade shows?�, �Shouldn't we focus more on R&D and services instead?� and �Do trade shows still make sense in the age of the Internet?�, to list just a few.
New head of SIPLACE product marketing
Mar 19, 2009 | Bernhard Fritz, 39, is the new head of product marketing at Siemens Electronics Assembly Systems GmbH & Ko. KG (SEAS). Fritz succeeds Holger Liebetruth, who is taking on other assignments within strategic marketing at Siemens AG.
Huawei commits to SIPLACE Placement Systems
Mar 19, 2009 | Huawei Technologies Co. is starting the second phase of its extensive investment program. Part of this expansion program, which was initiated in 2008, is the company's investment in further SIPLACE production lines. On Feb. 27, 2009, representatives of Huawei Technologies Co and Siemens Electronics Assembly Systems finalized the plans for an additional $6.8 million worth of SIPLACE equipment as a follow-up deal to the SIPLACE placement systems installed at the beginning of the year.
SEAS enhances SIPLACE sales and service activities in Poland
Mar 19, 2009 | Encon named new SIPLACE partner for Poland
New SIPLACE Internet presence goes online
Mar 19, 2009 | After the successful carve-out of Siemens Electronics Assembly Systems (SEAS), SIPLACE surprises its customers and other electronics production experts now with a new Internet presence. The www.siplace.com website was overhauled from the ground up.
SIPLACE MultiStar CPP head ensures optimally balanced production lines
Mar 19, 2009 | With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).
Siplace Precedence Finder optimizes placement sequence: Effective collision protection for the placement process
Jan 30, 2009 | Siplace Precedence Finder is a special program that improves the quality and reliability of component placements on high-mix and high-density boards. Based on the bill of materials, the software analyzes the size and position of all components on the PCB and optimizes the placement sequence to prevent components from colliding with each other or with nozzles and grippers. It effectively eliminates frequent collision sources such as shielding (large height differences between adjacent components) or placement shadows as a result of overlaying nozzles.
SIPLACE 3x8 mm shutterless S-feeder improves component supply
Jan 30, 2009 | S-series tape feeders have been one of the most important components of many Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) now presents another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version.
Siemens EAS expanding its technology expertise network
Jan 30, 2009 | Siemens Electronics Assembly Systems (SEAS), which has been a separate company since the start of the year, wants to further expand its global Siplace technology expertise network. By entering into additional cooperative agreements with other technology suppliers, SEAS wants to be able to offer their shared customers coordinated manufacturing solutions. SEAS believes that this optimized interaction between SMT equipment manufacturers will take advantage of significant, currently unused efficiency and productivity potentials in electronics production.
Carve-out completed successfully: Siemens Electronics Assembly Systems adjusts to market situation; wants to become faster and more flexible
Jan 30, 2009 | Right on schedule, Siemens Electronics Assembly Systems (SEAS) became operational on January 1, 2009, as a legally separate company within the Siemens technology conglomerate. This step signalled the end of the carve-out process, which started in 2008. At the same time, the Siplace Excellence restructuring program, which was begun in 2007, is entering into a second phase that involves making certain volume-driven adjustments.
Siemens New Product Preview APEX 2008 � Booth #2359
Mar 04, 2008 | SIPLACE X4i � Siemens placement machine with the world�s fastest throughput
Siemens to Form Joint Business Initiatives With Yazaki
Mar 26, 2001 | Siemens Automotive AG and the Yazaki Corp. are forming a worldwide cooperative initiative in electrical systems for passenger vehicles. The agreement with Yazaki involves two joint ventures for the sale, program management and development of vehicle electrical/electronic systems, for the combined global Siemens and Yazaki business at Ford Motor Co., BMW and Renault. A third joint venture will be dedicated to the manufacture of vehicle wiring harnesses. The transaction still requires regulatory and other approvals.
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