Company Information:
May 07, 2014 | Formula E s.r.l., a leading supplier of photovoltaic technology and automated manufacturing lines, and Engineered Materials Systems have entered into an agreement for the development of electrically conductive adhesives for use on Formula E automated manufacturing lines.
May 05, 2014 | Engineered Material Systems, Inc. (EMS) introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS).
Apr 15, 2014 | Engineered Material Systemsdebuts the CI-1062 Conductive Silver Ink for circuitry fabrication on wearable substrates.
Mar 31, 2014 | Engineered Material Systems debuts its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Feb 11, 2014 | Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.
Jan 29, 2014 | Engineered Material Systems (EMS) debuts its 585-1 Non-Conductive Paste (NCP) designed for flip chip packaging applications.
Jan 09, 2014 | Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Jan 07, 2014 | Engineered Material Systems debuts its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules.
Oct 29, 2013 | Engineered Material Systems, Inc., is pleased to introduce the DF-3020 Dry Film Negative Photoresist for use in micro-electro-mechanical systems (MEMS).
Oct 22, 2013 | Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.
Oct 04, 2013 | Engineered Material Systems Inc will showcase its DF-2000 Series Dry Film Negative Photoresists in booth #14 at the International Wafer Level Packaging Conference (IWLPC), scheduled to take place November 6-7, 2013 at the Doubletree Hotel in San Jose, Calif.
Sep 24, 2013 | Engineered Material Systems debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.
Sep 10, 2013 | Engineered Material Systemswill introduce its DB-1588-3 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in Hall 2, stand E6 at the 28th European Photovoltaic Solar Energy Conference scheduled to take place October 1-3, 2013 at Parc des Expositions Paris Nord Villipinte in Paris, France.
Sep 05, 2013 | Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.
Jun 24, 2013 | Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.
Jun 14, 2013 | Engineered Material Systems, Inc., introduces NR-2500 Liquid Negative Photoresist for use in micro-electromechanical systems (MEMS).
Jun 12, 2013 | Engineered Material Systems, announces the debut of its 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.
May 22, 2013 | Engineered Material Systems, Inc. (EMS) debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.
Apr 29, 2013 | Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
Apr 25, 2013 | Engineered Material Systems will debut its new DB-1588-2 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in booth #W3-688 at the 2013 SNEC 7th International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place May 14-16, 2013 at the Shanghai New International Expo Center in China.
Apr 04, 2013 | Engineered Material Systems, Inc., introduces the DF-1014 Dry Film Negative Photoresist for use in Micro-Electro-Mechanical Systems (MEMS). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Aug 10, 2012 | Engineered Conductive Materials introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules.
Jun 12, 2012 | Engineered Conductive Materials, LLC,will exhibit the new low temperature curing Conductive Adhesive DB-1541-LTC in North Hall, Booth #5619 at the upcoming Intersolar North America conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Jun 05, 2012 | Engineered Material Systems introduces 535-10M-1 UV Cured Adhesive formulated for disk drive camera module, optoelectronic and circuit assembly applications.
Jun 05, 2012 | Engineered Conductive Materials, LLC, introduces two next-generation conductive grid inks, CI-1031-7 and CI-1031-8, for use in thin-film solar modules.
Feb 22, 2012 | Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.
Feb 15, 2012 | Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.
Sep 07, 2011 | Engineered Materials Systems (EMS) will exhibit in Booth #853 at the upcoming Assembly & Automation Technology Expo
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