News Releases from Electronic Controls Design Inc. (ECD)
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12 news releases added by Electronic Controls Design Inc. (ECD)
Company Information:
ECD to Display Complete Range of Thermal Profiling and Verification Solutions, Introduce Breakthrough Oven Process Monitoring Technology at Productronica 2017
Oct 31, 2017 | At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization
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ECD Ranks Highest Among Soldering Equipment Providers, Honored with Second Consecutive Service Excellence Award
Mar 01, 2017 | ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.
ECD’s Customers Give High Marks for Service; Company Earns a Coveted Service Excellence Award
Apr 07, 2016 | At last month’s APEX event in Las Vegas, ECD was honored with one of the electronics assembly industry’s most prestigious awards, the Service Excellence Award. Unlike other contests that are voted on by a judging panel, the Service Excellence Award has particular cachet because winners are determined based on direct responses from participants’ customers, the true authorities of a company’s performance.
ECD Expands Successful SmartDRY™ Intelligent Dry Storage Portfolio with Addition of SmartDRY SD-48F
Mar 22, 2016 | Launched less than a year ago, ECD’s SmartDRY™ intelligent dry storage technology has dramatically changed the way manufacturers approach storage for moisture-sensitive devices (MSDs). With SmartDRY’s many unique features, electronics assembly specialists now have an affordable, sophisticated dry storage solution that is more conducive to dynamic manufacturing environments.
EI Microcircuits Leverages ECD’s Suite of Measurement Technologies to Ensure Robust Thermal Processes
Nov 01, 2015 | High-mix, medium-volume contract manufacturer, EI Microcircuits specializes in high-quality design, engineering and production of PCBs used in the industrial controls, medical and government sectors. With diverse and multiple jobs running throughout the Southern Minnesota-based EMS firm’s three facilities, ensuring tight reflow soldering processes is critical to high-yield and cost-effective manufacturing. For this important assembly process, EI Microcircuits relies on ECD’s M.O.L.E.® thermal profiling and OvenRIDER® technologies.
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ECD Taps Todd Clifton to Lead Company.
Sep 11, 2014 | ECD has named Todd Clifton as the company's new President to succeed founder and former President, Rex Breunsbach, who is downsizing his role at ECD. Clifton previously was ECD’s Vice-President of Sales and Marketing.
Do You Own the Oldest M.O.L.E.®? Enter to Win a SuperM.O.L.E.® Gold 2 kit
Nov 05, 2012 | ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit
ECD Releases M.O.L.E. MAP 3.00 Thermal Profiling Software; Customers Realize Cost and Time Savings
May 31, 2012 | Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
ECD Debuts Thermal Quality Management Program: ThQM
Apr 13, 2009 | ECD introduced its thermal quality management program, called ThQM, for OEMs and their volume manufacturers. It is designed to directly address the dialog required between OEMs and contract assemblers, including OEM requirements, machine recipe development, and thermal profile verification.
ECD Launches New Thermosphere BLOG for Electronics Industry
Apr 09, 2009 | ECD is proud to announce the release of the newest resource for it's customers. ECD Thermosphere will be covering topics from thermocouple attachment to "Wavy Profiles"
ECD Soldering Seminar Will Help Improve Yields, Reduce Re-work and Increase Profitability!
Aug 02, 2001 | Mr. Ray Chartrand, one of the leading experts in the Soldering Industry, in concert with ECD will be holding a series of cost-saving Profiling Seminar during August 2001. Ray has over 20 years experience troubleshooting soldering, reflow, and cleaning problems for the electronics industry and presently consults for over 40 of the largest industries in the electronic assembly marketplace.
Guide to QC Monitoring Available
Aug 02, 2001 | ECD has announced that its new Guide to Quality Control of the Automated Solder Process is now available. This 16 page Guide will provide users with important information about Classic PCB Temperature Profiling as well as how to maintain a wave or reflow solder machine in "factory-new" condition.
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