News Releases from Association Connecting Electronics Industries (IPC)
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1300 news releases added by Association Connecting Electronics Industries (IPC)
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TBBPA Ban Proposal Dropped; IPC Continues to Lobby for Scientific Basis in Directive
May 30, 2010 | BANNOCKBURN, Ill., USA — Efforts by IPC — Association Connecting Electronics Industries® to bring sound scientific analysis to the RoHS Directive were rewarded when RoHS Rapporteur and Green Party member Jill Evans announced plans to drop amendments calling for a ban of all brominated flame retardants (BFRs), including those, such as tetrabromobisphenol-A (TBBPA), that have been found safe under European Union risk assessment.
IPC Strives for Genuine Benefits to Environment and Human Health in EU Legislation
May 26, 2010 | BANNOCKBURN, Ill., USA — In communications sent to Members of the European Parliament (MEPs) last week, IPC — Association Connecting Electronics Industries® lent its support to the adoption of RoHS Directive proposed amendments 197 through 203. These amendments support the use of a rigorous scientific methodology to evaluate additional restricted substances and their alternatives.
IPC RELEASES PCB INDUSTRY RESULTS FOR MARCH 2010
Apr 27, 2010 | BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® announced today the March findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Key Political Figures to Speak at IPC’s Capitol Hill Day
Apr 27, 2010 | BANNOCKBURN, Ill., USA — As U.S. companies in the electronics interconnect industry roll up their sleeves to get down to business at IPC’s Capitol Hill Day, two Washington insiders will be sharing their insights on influencing public policy. IPC’s Capitol Hill Day on June 9–10, 2010, will feature Charles “Charlie” Black, Jr. and U.S. Rep. Maurice Hinchey of New York as the keynote and luncheon speakers respectively. The event will focus on influencing legislators on issues critical to the global competitiveness of the electronic interconnect industry.
Mel Parrish Elected to Chair IPC’s Top Standards Development Leadership Committee
Apr 23, 2010 | BANNOCKBURN, Ill., USA, IPC — Association Connecting Electronics Industries® announces the election of Mel Parrish, FSO and director of training materials, STI Electronics Inc., to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term.
New A Revision of IPC-4202 Gives Updated Guidance in Flexible Base Dielectric Materials
Apr 23, 2010 | BANNOCKBURN, Ill. IPC - Association Connecting Electronics Industries® has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more easily determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.
IPC APEX EXPO 2010 HONORS BEST INDUSTRY POSTERS AND ACADEMIC POSTER COMPETITION WINNERS
Apr 23, 2010 | BANNOCKBURN, Ill., USA — Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC – Association Connecting Electronics Industries® announced the 2010 Best Industry Posters and the winners of the second annual IPC Academic Poster Competition at IPC APEX EXPO, held April 6–8, 2010 in Las Vegas.
Increased Attendance at IPC APEX EXPO 2010 Hails Visible End to Recession
Apr 23, 2010 | BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® has released verified attendance figures from IPC APEX EXPO™, held April 6–9, 2010, in Las Vegas, indicating a 10 percent increase over last year with 3,702 attendees.
IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012
Apr 19, 2010 | BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.
Save more than $300 on new IPC standards.
Apr 16, 2010 | IPC has released updates to key standards that affect your business. New versions of printed board standards IPC-A-600 and IPC-6012 have been released, along with key assembly standards IPC-A-610 and J-STD-001. If you become a member now, you will be eligible to get free copies of all of these standards, saving up to $393. And, of course, as more new standards are published, you can request a copy within 90 days, adding to your savings!
Jack Bramel Receives IPC Raymond E. Pritchard Hall of Fame Award
Apr 11, 2010 | BANNOCKBURN, Ill., USA — In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees and exceptional lifetime achievement, Jack Bramel, Jack Bramel & Associates was awarded the 2009 IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO™ in Las Vegas, the Hall of Fame Award represents IPC’s highest level of member recognition.
IPC Elects New Officers/Members to Board of Directors
Apr 10, 2010 | The Nominating and Governance Committee of the IPC Board of Directors presented six candidates for election at the IPC Annual Meeting, on Tuesday, April 6, 2010, in conjunction with IPC APEX EXPO™ in Las Vegas. Three candidates were elected as board officers and will serve two-year terms covering April 2010 through March 2012. The other three candidates were elected as board directors and will serve four-year terms, covering April 2010 through March 2014.
IPC HONORS BEST PAPERS AT IPC APEX EXPO 2010
Apr 10, 2010 | IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Volunteers Honored for Their Contributions to IPC and Industry
Apr 10, 2010 | IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas.
DuPont and Raytheon Company Honored with 2010 IPC Corporate Recognition Awards.
Apr 10, 2010 | IPC — Association Connecting Electronics Industries® yesterday bestowed its highest corporate honors to Raytheon Company and DuPont. During the IPC Annual Meeting Luncheon held in conjunction with IPC APEX EXPO™, IPC awarded the Stan Plzak Corporate Recognition Award upon Raytheon Company and the Peter Sarmanian Corporate Recognition Award upon DuPont. Leaders and innovators within their respective industries, both companies have been long-time IPC supporters.
Bob Black Awarded the IPC President's Award
Apr 10, 2010 | IPC - Association Connecting Electronics Industries® honored Bob Black, president and CEO of Juki Automation Systems, Inc. with the coveted IPC President’s Award at IPC APEX EXPO™, April 6, 2010. This prestigious award is presented to IPC members who have exhibited ongoing leadership in IPC and have made significant contributions of their time and talent to the association and the electronics interconnect industry.
Updated Materials Declaration Standard IPC-1752A Addresses Revolving Door of Environmental Regulation Changes.
Apr 10, 2010 | Helping electronics manufacturing companies better manage the growing documentation required to ensure products comply with evolving environmental regulations, IPC — Association Connecting Electronics Industries® has released IPC-1752A, Materials Declaration Management. The A revision of the standard provides an updated and expanded industry-wide reporting format for material declaration data exchange between companies in the electronic interconnect supply chain.
IPC-A-610E Released: Industry Requirements for Acceptability of Electronic Assemblies Updated.
Apr 10, 2010 | IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.
Apr 10, 2010 | If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated
Apr 10, 2010 | IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.
Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling
Apr 10, 2010 | IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
IPC International Conference Offers Answers to Chalenges of Flexible Circuits.
Mar 27, 2010 | BANNOCKBURN, Ill, USA, - One of the fastest growing segments of the PCB market worldwide, flexible circuits provide new opportunities in the areas of creative design, miniaturization, circuit density and interconnection reliability to help boost a company’s bottom line.
IPC Releases PCB Industry Results for February 2010
Mar 27, 2010 | BANNOCKBURN, Ill., USA, - IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.
Mar 27, 2010 | BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
IPC PCB Executive Agent Task Force Optimistic About Efforts: Two Government Reports Recognize Vital Role of U.S. PCB Industry.
Mar 27, 2010 | BANNOCKBURN, Ill., USA, - Following a year of active engagement with Congress and Department of Defense (DoD) policy makers, IPC and the IPC PCB Executive Agent Task Force members' are pleased to see their efforts are having a noticeable effect. Two recently released reports from the DoD and the U.S. Commerce Department emphasize the government’s growing awareness of the importance of the U.S. printed circuit board industry in protecting national security.
MORE THAN 120 NEW PRODUCTS TO DEBUT AT IPC APEX EXPO
Mar 22, 2010 | BANNOCKBURN, Ill, USA, March 19, 2010 — In a positive sign that economic recovery is on the upswing, more than 120 new products and services from companies in the electronics manufacturing industry will debut at IPC APEX EXPO™, April 6–8, 2010, at the Mandalay Bay Resort and Convention Center in Las Vegas.
IPC Urges EU Leaders to Incorporate Science In RoHS Directive Recast
Mar 17, 2010 | BANNOCKBURN, IL — IPC – Association Connecting Electronics Industries® has released a white paper, Recasting the RoHS Directive: An Opportunity to Solidify its Scientific Basis in Support of Comprehensive Environmental Regulation, urging members of the European Union (EU) Council and Parliament to ensure that the revised RoHS Directive be scientifically based and fully aligned with the Registration, Evaluation, Authorisation and Restriction of Chemicals (REACH) Regulation. Copies of the white paper will be sent to members of the EU Council and members of the EU Parliament's Environment Committee.
IPC Developing Best Industry Practices for Intellectual Property Protection — Seeks Industry Input
Mar 17, 2010 | BANNOCKBURN, Ill., USA, March 16, 2010 — The IPC Intellectual Property Committee will release its first draft of a standard for the protection of intellectual property (IP) designed into printed circuit boards at an open meeting, Tuesday, April 6, 2010, at IPC APEX EXPO® in Las Vegas.
Two Industry Veterans Receive IPC's 2009 Hall of Fame Award
Apr 15, 2009 | BANNOCKBURN, Ill., USA, March 31, 2009 � IPC � In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees, and exceptional lifetime achievement, IPC � Association Connecting Electronics Industries� bestowed the 2009 Raymond E. Pritchard IPC Hall of Fame Award to Bill Jacobi, former president and CEO, William Jacobi and Associates, and Dan Feinberg, owner, Fein-Line Associates. Presented at IPC APEX EXPO� in Las Vegas, the Hall of Fame Award represents IPC's highest level of member recognition.
Phoenix International and Uyemura International Corp. Earn IPC Corporate Recognition Awards
Apr 15, 2009 | BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� is pleased to honor Uyemura International Corp. and Phoenix International with the Peter Sarmanian and Stan Plzak Corporate Recognition Awards respectively. These awards are bestowed in recognition of their steadfast support of IPC and significant contributions of time and expertise to standards development and other vital IPC activities. The companies were recognized during the IPC Annual Meeting and Luncheon, March 31, 2009 in Las Vegas.
Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�
Apr 15, 2009 | BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.
IPC Honors Best Papers at IPC APEX EXPO� 2009
Apr 15, 2009 | BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Standards Development, Business Development and Professional Development at IPC APEX EXPO Boost Industry Spirit and Progress
Apr 15, 2009 | BANNOCKBURN, Ill., USA, April 14, 2009 � �This is a very exciting time �� � not exactly words often heard these days, but according to David Buhrkuhl, president of SPEA America, even within these economic times, �new technologies are driving the industry,� and opportunities do exist. At the recent IPC APEX EXPO� in Las Vegas, the opportunities for learning and business development were ever-present. Despite attendance figures lower than last year, 6,077 attendee and exhibitor individuals from 42 countries gathered together to take advantage of the educational sessions, standards committee meetings and business development activities on and off the exhibit floor.
IPC and JEDEC Help Industry Transition to Lead Free Associations Host Conference on Transitioning to Lead Free � Strategies for Implementation
Feb 21, 2009 | BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.
IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Four Speakers
Oct 26, 2008 | ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dave Adams (Session Chair) of Rockwell Collins, Lee Flasche of Delphi Electronics Group, Dr. Ning-Chen Lee of Indium Corporation, Steve Hugh of Philips Medical, and Dr. Ken Dishart formerly of DuPont will present in Session 4 on Lead-Free Cleaning. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008
IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Is More than 90 Percent Sold Out
Oct 26, 2008 | ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that the jointly sponsored High-Performance Electronics Cleaning Symposium that will be held at the Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008 is nearly sold out, with less than 10 percent capacity remaining.
IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Is More than 90 Percent Sold Out
Oct 26, 2008 | ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that the jointly sponsored High-Performance Electronics Cleaning Symposium that will be held at the Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008 is nearly sold out, with less than 10 percent capacity remaining.
IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Five Speakers
Oct 25, 2008 | ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Harald Wack (Session Chair) of Zestron Corporation, Jason Keeping of Celestica, Barry Richie of Dow Corning Corporation, Phil Kinner of Humiseal, and Lamar Young of Specialty Coating Systems will present in Session 5 on Conformal Coating Adhesion. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Panel Discussion on Cleaning Process Integration
Oct 20, 2008 | ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Steve Stach, President of Austin American Technology, will moderate a collaborative panel discussion on process integration. The panelists will comprise OEM and EMS process engineers who have experience and expertise in implementing cleaning processes. The panelists include Dave Adams of Rockwell Collins, Jerry Purnell of Philips Medical, Jeff Kennedy of Celestica, Jim Raby of STI Electronics, Dale Lee of Plexus, and Linda Woody of Lockheed Martin. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Panel Discussion on Electronic Equipment Designs
Sep 29, 2008 | ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dave Torp, IPC Vice President of Technology and Standards, will moderate a collaborative panel discussion on cleaning equipment designs. The panelists will comprise cleaning equipment experts including Steve Stach of Austin American Technology, Mike Konrad of Aqueous Technologies, Jim Timler of Steolting/Trek, John Neiderman of Speedline Technologies, Roger Travato of Technical Devices, and Eric Larson of Crest Ultrasonic. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Three Speakers
Sep 21, 2008 | ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Joe Russeau (Session Chair) of Precision Analytical Laboratory, Dr. Bev Christian of Research in Motion, Dave Hillman of Rockwell Collins, Matt Kehoe of Sipad Systems, and Doug Schueller of AbleConn will present during Session 3 on Building to Customer Reliability Standards in Class 2 and Class 3. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Two Speakers
Sep 12, 2008 | ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Laura Turbini (Session Chair) of Research in Motion, Doug Pauls of Rockwell Collins, Joe Russeau of Precision Analytical Laboratory, Steven Perng of Cisco Systems, and Jack Fischer of Interconnect Technology Analysis will present in Session 2 on Cleanliness Assessment. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Call for Participation for IPC APEX EXPO 09
Jul 08, 2008 | IPC APEX EXPO is the world's premier conference & exhibition for the electronic interconnect industry, developed and presented by the industry for the industry. Be a leader in printed board manufacturing or design, electronics assembly, manufacturing or test. Submit an abstract or course proposal today!
Record Number of New Products and Services to Be Introduced at IPC Printed Circuits Expo�, APEX� and the Designers Summit
Mar 14, 2008 | New products! New solutions! New, world famous venue! It all adds up to be the most exciting IPC Printed Circuits Expo�, APEX� and the Designers Summit yet. Make your plans now to join your colleagues in Las Vegas, April 1�3, 2008. Visit www.GoIPCShows.org.
IPC Sponsors Endicott Technology Interchange:
Mar 03, 2008 | BANNOCKBURN, Ill., USA, February 26, 2008 � Technological advances on the horizon and future industry demands � this is the focus of �Will You Be Ready?: An Endicott Technology Interchange,� sponsored by IPC � Association Connecting Electronics industries�.
Updated Information on the IPC/ HKPCA Dongguan 2004 Event
Sep 22, 2004 | IPC and HKPCA�s premier industry event, International Printed Circuit and Electronics Assembly Fair will be held in Dongguan, China from December 8-10, 2004
IPC Releases Revised Key Printed Circuit Board Qualification and Acceptability Standards
Sep 07, 2004 | NORTHBROOK, Ill., September, 2004
IPC Releases IMS/PCB Book-to-Bill Ratio
May 04, 2004 | and IMS/PCB Business Report for March 2004
2003 Designers Learning Symposiums Take Shape
Sep 11, 2003 | The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer
IPC Designers Council�s Certification Program Reaches Milestone
Sep 11, 2003 | IPC Designers Council announces that it has now granted more than 2,000 printed circuit board (PCB) designers Certified Interconnect Designer (CID) designation through its PCB Designer Certification Program.
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