News Releases from Zymet, Inc
Read Zymet, Inc company news
- SMTnet
- »
- News
- »
- News Contributors
- »
- News Releases from Zymet, Inc
7 news releases added by Zymet, Inc
Company Information:
Zymet Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4
Feb 08, 2013 | Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
New Underfill from Zymet for 0.4-mm pitch POP's
Jan 13, 2012 | Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill
Apr 07, 2011 | Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Low CTE Reworkable Underfill for Superior Thermal Cycle Performance
Mar 17, 2010 | EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Reworkable Underfill for Package-on-Package (POP)
Sep 17, 2009 | EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Reworkable Underfill Encapsulant for BGA's
Apr 27, 2004 | Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Reworkable Underfill Encapsulant for CSP's and BGA's
Sep 25, 2003 | Reduce waste and cost.
- SMTnet
- »
- SMT, PCB Electronics Industry News
- »
- Zymet, Inc
- »
- Zymet, Inc News
