News Releases from Vi TECHNOLOGY
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70 news releases added by Vi TECHNOLOGY
Company Information:
Vi TECHNOLOGY to Exhibit with Fenwick Iberica at Matelec 2014 Vi TECHNOLOGY to Showcase Pi SPI and 2K Spectro for Post-Reflow
Oct 22, 2014 | Vi TECHNOLOGY will exhibit in Booth 4C16 with its representative, Fenwick Iberica S.A., at Matelec 2014, scheduled to take place Oct. 28-31, 2014 at Ifema - Parque Ferial Juan Carlos I in Madrid, Spain.
Vi TECHNOLOGY Brings State-of-the-art Inspection to SMTAI
Aug 28, 2014 | Vi TECHNOLOGY announces that it will exhibit in Booth #319 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Vi TECHNOLOGY Appoints New Sales Representative in Germany
Aug 26, 2014 | Vi TECHNOLOGY has appointed Rothmeier SMT Solutions to promote the sales of its complete product range to customers in Southern Germany.
Vi TECHNOLOGY awards Macon as best distributor for Americas
May 28, 2012 | Vi TECHNOLOGY announced presentation of its highest agent honor, the American Representative Challenge Award, to Macon, Vi TECHNOLOGY’s sales representative for Argentina. The award was presented during the IPC APEX exhibition in San Diego, CA.
Vi TECHNOLOGY Introduces SPECTRO – The Latest in High Resolution Color AOI
Feb 22, 2012 | Vi TECHNOLOGY announced today the Americas debut of SPECTRO, its high resolution/high speed AOI solution for the most demanding of circuit board inspection requirements. “This exciting new camera technology will be featured on our new 2K SPECTRO AOI system in Booth 2749 at the IPC APEX EXPO” said Jean-Marc Peallat, VIT President & CEO Americas.
Vi TECHNOLOGY customer survey Apple iPad2 winner
Nov 10, 2011 | At the world’s largest electronic equipment exhibition - Productronica 2011 - in Munich, Vi TECHNOLOGY will present a new Apple iPad 2 to a customer chosen at random from the respondents to a recently completed Global Customer Satisfaction survey.
Vi TECHNOLOGY introduces 5K SPECTRO at Booth 435, Hall A2, Productronica in Munich
Nov 10, 2011 | Vi TECHNOLOGY announced that they will launch 5K SPECTRO, a new AOI inspection machine, at Booth 435, Hall A2, Productronica in Munich on 15 November, 2011.
Vi TECHNOLOGY appointed authorized distributor Fenwick Iberica SA in Spain and Portugal
Nov 10, 2011 | Vi TECHNOLOGY confirmed the appointment of Fenwick Iberica SA, as authorized distributor for Spain and Portugal, for their range of innovative automatic inspection equipment (AOI) and software solutions for SMT Production lines.
Vi TECHNOLOGY appointed authorized distributor SMT Solutions ApS in Demark
Nov 10, 2011 | Vi TECHNOLOGY appointed authorized distributor SMT Solutions ApS of Denmark for their customer-oriented strategy as well as their growing range of innovative inspection equipment and software solutions to address a wide range of applications for PCB assembly.
Vi TECHNOLOGY® Introduces Vision 20 To meet today's industry challenge @ NEPCON South China 2011
Aug 22, 2011 | Vi TECHNOLOGY will be represented with its agents to introduce Vision 20, the latest Vi TECHNOLOGY’s software suite, to meet today’s industry challenge at NEPCON South China.
Vi TECHNOLOGY Americas appoints Russell Claybrook as Regional Sales Manager
Aug 17, 2011 | Vi TECHNOLOGY is proud to announce the appointment of Russell Claybrook as Regional Sales Manager, effective now.
Vi TECHNOLOGY exhibits its latest AOI solution REVEAL Imager at SEMICON Taiwan 2010
Aug 17, 2010 | Vi TECHNOLOGY exhibits its latest semiconductor AOI solution REVEAL Imager at Semicon Taiwan 2010 (Taipei World Trade Center) from September 8th to 10th, in co-exhibition with STC at booth 862.
Vi TECHNOLOGY®'s component inspection solutions to reduce defective PCBAs @ Nepcon Shenzhen 2010
Aug 09, 2010 | Vi TECHNOLOGY will be represented with its Chinese Agents to exhibit AOI solutions to reduce defective PCBAs at Nepcon South China Shenzhen from August 31st to September 2nd.
Vi TECHNOLOGY launches the REVEAL Imager AOI Series, a breakthrough inspection solution for the Camera Modules manufacturing industry at SEMICON West 2010, booth 5377
Jul 09, 2010 | Vi TECHNOLOGY introduces the REVEAL Imager Series, at SEMICON West 2010 from July 13th to 15th, Booth 5377 - North Hall – San Francisco Moscone Center. Along with the product an automatic JEDEC Tray loader compatible with both REVEAL Imager and REVEAL MEMS Series will be demonstrated.
Vi TECHNOLOGY welcomes Koen Gutscoven as Worldwide Sales Vice-president
May 24, 2010 | Saint-Egrève, France, 2010 - Vi TECHNOLOGY is pleased to welcome Koen Gutscoven as Worldwide Sales Vice-president, since May 18th to head up Vi TECHNOLOGY worldwide sales activities reporting directly to him.
Vi TECHNOLOGY is hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrate solutions reducing defective PCBAs at SMT/HYBRID/PACKAGING 2010
May 11, 2010 | Saint-Egrève, France - Vi TECHNOLOGY is pleased to be hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrates its 5K Series at SMT/HYBRID/PACKAGING 2010. More VIT equipment will also be presented at our agent’s booth 7-219, SmartTech to demonstrate solutions reducing defective PCBAs.
Vi TECHNOLOGY exhibits its full product range of AOI solutions at Nepcon China booth 4F10
Apr 14, 2010 | Saint-Egrève, France - Vi TECHNOLOGY exhibits its full product range of AOI solutions to reduce defective PCBAs at Nepcon China 2010 at Shanghai, from April 20th to 22nd booth 4F10.
Vi TECHNOLOGY Inc. signs partnership with Lewis & Clark
Mar 22, 2010 | Richardson, USA, 2010, March 18th - Vi TECHNOLOGY Inc. announced, the signature of a partnership with the American based Company Lewis & Clark, leader in selling and servicing SMT second hand equipments.
ViTechnology Introduces VITS
Jan 21, 2008 | Powerful E-Learning Tool Delivers High-Impact Training and Demonstration Materials
New Photonic Soldering System For Selective Assembly.
Jan 25, 2001 | ViTechnology introduces the LS-200 for selective soldering and rework of all types of components, from BGAs to large QFPs and even odd-shaped and hybrid devices. This new system is ideal for soldering and desoldering RF shielding and various paste in hole and solder-paste-on-through-hole applications. The LS-200 offers high quality rework with fewer rejects, and a 30% shorter repair time when compared to hot air systems.
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