Company Information:
Apr 03, 2012 | Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces its 535-10M UV Cured Epoxy formulated for disk drive, camera module, optoelectronics and circuit assembly applications.
Mar 30, 2012 | Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.