Company Information:
Feb 04, 2008 | The European Institute of Printed Circuits (EIPC) extends an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Summer Conference which is to be held onMay 29 & 30 2008 in Dresden, Germany.
Jan 30, 2003 | Changing Circumstances - New Possibilities
Aug 20, 2002 | October 7 - 10