News Releases from BSU Incorporated
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4 news releases added by BSU Incorporated
Company Information:
BSU Achieves IPC-620 Certification
Jul 22, 2021 | BSU, Inc. recently announced that the company, a growing EMS provider in Austin, Texas, has achieved IPC-620 Certification to support its growing cable assembly business (RF, shielded, unshielded, twisted pair, coax, flex, and others).
Flying Probe Testing Ensures PCBA Quality, Reliability at BSU
Jun 30, 2021 | Flying Probe Testing is an integral part of Printed Circuit Board Assembly (PCBA) at BSU Inc., ensuring that the correct electronic components are properly positioned and operating correctly on customers' assembled electronic products. Such testing ensures the robust reliability and quality of each PCBA assembled, states Ahmad Chamseddine, President. BSU Inc. is a growing EMS company centrally located in Austin, Texas.
Automated Optical Inspection (AOI) Ensures Defect-free PCB Assemblies at BSU
Jun 23, 2021 | BSU, Inc. incorporates advanced Automated Optical Inspection (AOI) into build process for each and every Printed Circuit Board Assembly (PCBA) assembled at its manufacturing facility. "AOI capability ensures that our customer's products are free of visible defects and thus are reliable and high quality," states Ahmad Chamseddine, President. "AOI uses machine vision to very quickly and accurately examine every assembly for surface defects, dimensional defects, and component placement errors. It enables us to ensure that the product is of high quality without any visible manufacturing defects."AOI is an integral part of Printed Circuit Board Assembly (PCBA) at BSU Inc., a growing EMS company centrally located in Austin, Texas.
BSU Inc. Updates High-Performance X-ray Inspection Capability
May 10, 2021 | BSU Inc. has updated its high-performance X-ray inspection capability with the installation of a Nikon XT V Series world-class X-ray and CT inspection system. In addition to inspecting many areas of SMT/PCB assemblies that are generally inaccessible to visual inspection, the new X-ray system will be used to inspect Ball Grid Array (BGA), leadless, and connector components to identify problems such as solder joint defects, shorts, opens, etc...
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