News Releases from EMS International Corporation
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4 news releases added by EMS International Corporation
Company Information:
Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America
Jul 07, 2016 | Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications
Feb 08, 2016 | Engineered Materials Systems announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications.
Engineered Materials Systems receives IDTechEx award for printed electronics technology
Jan 25, 2016 | Nagase America is pleased to announce that Engineered Materials Systems, Inc. (EMS), a Nagase Group company, received the IDTechEx Best Commercialization Award for its achievement in printed electronics technologies at Printed Electronics USA 2015. The award was for the use of EMS’s stretchable conductive ink in Mimo, a wearable smart baby monitor manufactured by Rest Devices. Entries were judged by a panel of three industry experts.
Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist
Jan 25, 2016 | Engineered Material Systems is pleased to introduce the DF-3010 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
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