News Releases from Finetech
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88 news releases added by Finetech
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Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019
Jan 14, 2019 | Finetech will demonstrate the new SMART DESOLDER 01 at the upcoming IPC APEX Conference scheduled for January 29-31 in San Diego (booth #2427).
Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016
Apr 07, 2016 | Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.
Martin Streamlines and Simplifies Rework with New Process Shuttle
Nov 27, 2013 | Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.
Finetech Unveils High Force ACF Bonder
Nov 08, 2013 | Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.
Al Cabral Joins Finetech as Regional Sales Manager
May 28, 2013 | Finetech & Martin announce the appointment of Al Cabral as Regional Sales Manager.
Donated Finetech Die Bonder Installed at Pennsylvania State University
Mar 11, 2013 | A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.
Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO
Jan 16, 2013 | Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO
Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West
Jan 04, 2013 | Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder
The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International
Oct 03, 2012 | Finetech will highlight the FINEPLACER® core rework system in the Finetech/Martin Booth #236 at the upcoming SMTA International Conference and Expo
MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show
Sep 26, 2012 | MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show,
MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012
Sep 10, 2012 | MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego
Sep 05, 2012 | Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition
Pennsylvania State University Wins Finetech Die Bonder Donation
Aug 29, 2012 |
Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.
MARTIN’s EXPERT 04.6IXM: Reworking Heavy Substrates
Jun 04, 2012 | MARTIN has expanded its successful EXPERT 04.6 rework station series with a new configuration to rework LEDs and power components on heavy (metal or ceramic) boards.
MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum
May 31, 2012 | MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum
Rochester Institute of Technology Partners with MARTIN to Provide Rework Training & Research
May 15, 2012 | Rochester Institute of Technology has partnered with equipment supplier MARTIN to utilize a MARTIN Expert 10.6 Rework Station and Mini-Oven unit in its Center for Electronics Manufacturing and Assembly (CEMA)
MIRTEC RECEIVES PRESTIGIOUS EM ASIA INNOVATION AWARD FOR ITS TECHNOLOGICALY ADVANCED MV-9 3D AOI SERIES
Apr 26, 2012 | “The Global Leader in Inspection Technology”, announces that it has been awarded the 2012 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its revolutionary MV-9 3D AOI Series.
Finetech Shows Support for University Research
Feb 07, 2012 | Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.
The Best in Rework Technology – Finetech to Exhibit FINEPLACER® core rework system at the 2012 IPC APEX Expo
Jan 24, 2012 | Finetech will highlight the FINEPLACER® core rework system in Booth #3020 at the upcoming IPC APEX Expo,.
Finetech Wins Respected Global Technology Award for Its FINEPLACER® matrix ma Bonder
Nov 20, 2011 | Finetech has been awarded a Global Technology Award in the category of Bonding Equipment for its FINEPLACER® matrix ma.
Finetech Opens Cleanroom in Berlin
Sep 14, 2011 | Finetech announces that comprehensive construction measures to remodel and expand the development and manufacturing facilities at Berlin headquarters have been completed.
FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach
Sep 12, 2011 | FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition
Innovations for FINEPLACER® lambda to be highlighted at Productronica 2011
Sep 06, 2011 | At Productronica 2011, Finetech will present a number of smart improvements and new options for the FINEPLACER® lambda.
FINEPLACER® Micro Assembly Highlights at Productronica 2011
Aug 30, 2011 | At this year’s Productronica 2011, booth #A4-281, Finetech will present selected highlights from the acclaimed FINEPLACER® bonder range.
Professional Solutions for Hot Air SMD Rework
Aug 24, 2011 | From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.
Finetech Hires Norm Faucher as Applications Engineer
Aug 22, 2011 | Finetech has appointed Norm Faucher to the position of Applications Engineer effective immediately. A veteran in the electronics industry, Norm brings many years of SMT soldering expertise and customer support experience.
Finetech Sells 12 Bonding Systems to University Labs to Advance Research
Jun 01, 2011 | Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
8th Finetech International User Meeting
May 19, 2011 | On September 29, 2011, Finetech will hold the 8th International User Meeting “Micro Assembly” in Berlin. This series of events aims at prospects, users and experts alike and has become a fixed point of the annual industry calendar, attracting a steadily growing number of visitors.
Finetech to Exhibit at NEPCON China 2011
Apr 20, 2011 | Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.
FINETECH to Showcase FINEPLACER® core rework system at IPC APEX EXPO 2011
Mar 11, 2011 | FINETECH will highlight the FINEPLACER® core rework system in Booth #1940 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums
Feb 17, 2011 | MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.
FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011
Feb 14, 2011 | FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.
FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011
Jan 05, 2011 | FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.
MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum
Nov 18, 2010 | MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.
Finetech to Highlight Compact Rework System FINEPLACER® core at the SMTA Penang Vendor Show
Nov 08, 2010 | Finetech will highlight the FINEPLACER® core rework system at the upcoming SMTA Penang Vendor Show, Table 8, on November 19, 2010 at the Eastin Hotel in Penang, Malaysia.
FINETECH/MARTIN to Host SMTA Boston Chapter Meeting
Oct 06, 2010 | FINETECH/MARTIN announces that it will host the upcoming SMTA Boston Chapter meeting on Tuesday, October 12, 2010 at its facility in Manchester, NH. Joe Belmonte, Principal Consultant at ITM Consulting, will present "Considerations in Miniature SMT Component Assembly."
FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010
Oct 04, 2010 | FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.
MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum
Oct 04, 2010 | MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.
Finetech to Highlight Precision Rework and BGA Reball systems at SMTAI 2010
Oct 01, 2010 | Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo
Sep 15, 2010 | MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
Finetech to Highlight Compact Rework System FINEPLACER® core at GEM Expo 2010
Sep 08, 2010 | Finetech will highlight the new FINEPLACER® core rework system in distributor SMAtech Brazil‘s booth #317 at the upcoming GEM Expo 2010, scheduled to take place October 5-7, 2010 at the prestigious, state-of-the-art Expo Center Norte in São Paulo, Brazil.
MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Ohio Valley Expo & Tech Forum
Jun 30, 2010 | MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010
Jun 23, 2010 | FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.
MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Upper Midwest
May 29, 2010 | MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
FINETECH to Exhibit at ECTC 2010
May 24, 2010 | FINETECH will exhibit in booth 403 at the Technology Corner of the Electronic Components and Technology Conference (ECTC), scheduled to take place June 2-3, 2010 at the Paris Las Vegas Hotel in Las Vegas.
MARTIN’s Expert 10.6XL Wins a 2010 VISION Award
Apr 11, 2010 | MARTIN, a FINETECH company, announces that it has been awarded a 2010 SMT VISION Award in the category of Rework and Repair for its Expert 10.6XL Rework System. The award was presented to the company during a Monday, April 5, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2010.
ProWorks to Exhibit at IPC/APEX 2010
Mar 27, 2010 | POMONA, CA - ProWorks, a division of Everett Charles Technologies, will demonstrate its new productivity modules in the Everett Charles Technologies booth, #1782, as well as in the ScanCAD booth, #1447, at the upcoming IPC/APEX conference and exhibition.
MARTIN to Introduce Expert 10.6XL Rework System for Large PCBs at APEX 2010
Mar 27, 2010 | MARTIN, a FINETECH company, will demonstrate the new Expert 10.6XL Rework System in booth #638 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.
FINETECH to Debut Core Rework System at APEX 2010
Mar 24, 2010 | FINETECH will debut the new FINEPLACER Core rework system in booth #2329 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.
MARTIN to Demonstrate Compact, Stand-alone BGA Reball Unit at APEX 2010
Mar 24, 2010 | MARTIN, a FINETECH company, will demonstrate the Reball 03.1 unit in booth #638 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.
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