News Releases from Finetech
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88 news releases added by Finetech
Company Information:
MARTIN Appoints Sales Manager for U.S., Canada and Mexico
Mar 08, 2010 | MARTIN, a FINETECH company, has appointed Scott Rushia as Sales Manager for the U.S., Canada and Mexico. In his new role, Rushia is responsible for sales and service for Martin’s rework and dispensing products.
ECT’s CPG TO FEATURE SEMICONDUCTOR PROBES AT BiTS 2010
Feb 11, 2010 | Pomona, CA, February 2010 — Everett Charles Technologies (ECT) Contact Products Group (CPG) will feature the latest semiconductor probes at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.
BPM Microsystems Outperforms Competition with Two-Day Flash Memory Support Lead Times and Offers Reduced Price Option for Flashstream® Annual Support Agreement
Feb 11, 2010 | HOUSTON — February 10, 2010 — As the leader in flash memory programming technology, BPM Microsystems continues to outperform its competition by offering a guaranteed delivery date for new flash memory algorithm support in as fast as two business days and by offering a new reduced price annual support agreement option for the Flashstream® starting at MSRP $995.
High Accuracy Die Bonder on Display at SPIE Photonics West 2010
Jan 07, 2010 | FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.
Finetech Reports Good Attendance at Productronica 2009
Dec 07, 2009 | At Productronica 2009 in Munich, Finetech is starting into a new era of its history and is pleased to report good attendance and keen interest in the displayed products.
New FINEPLACER® core –Debut at Productronica 2009
Dec 07, 2009 | At the Productronica 2009 tradeshow in Munich, Finetech will introduce its upcoming entry-level rework system, the FINEPLACER® core.
Finetech to Acquire Martin GmbH, Munich
Dec 07, 2009 | We are pleased to announce the acquisition by Finetech GmbH & Co. KG, Berlin of MARTIN GmbH, Wessling near Munich. Finetech CEO, Gunter Kuerbis explains that the Martin products complement perfectly the range of systems successfully sold around the world under the flagship FINEPLACER® name. Additionally, MARTIN CEO, Bernhard Martin sees that the addition of dispenser technology, a core capability of his company, will provide a broader product offering range to Finetech’s already significant position in the Rework and Micro-assembly arena.
FINEPLACER® matrix – "The new generation" World premiere at Productronica in Munich
Dec 07, 2009 | With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family. The modular thinking behind the FINEPLACER ®s has been further perfected. Depending on the customer's requirements, the platform can be configured either as a high-end rework system or as a high-precision assembly and bonding system. In each case there are two accuracy options available, of 10 µm and 3 µm.
Finetech launches a new brand identity at Productronica
Dec 07, 2009 | Finetech GmbH & Co. KG, manufacturer of SMD rework and micro assembly equipment, will present a new brand identity from November. This stems from a process of change over many years, which is reflected in the sales structures and product range, as well as other areas.
FINETECH GmbH Acquires Martin GmbH
Nov 15, 2009 | FINETECH GmbH announces the acquisition of Martin GmbH, a manufacturer of rework and dispensing equipment located in Wesseling, Germany.
High Accuracy Die Bonder on Display at IMAPS 2009
Oct 16, 2009 | FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.
FINETECH to Demonstrate Compact Rework System at SMTAI 2009
Sep 18, 2009 | Tempe, AZ - FINETECH will exhibit the FINEPLACER® CRS 10 rework system in booth 322 at the upcoming SMTA International, scheduled for October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA. The system will demostrate rework of 0201 passives, BGA‘s, and QFN devices, as well as residual solder removal.
Cobar Solder Products to Exhibit XF3+ and 396-DRX at SMTAI 2009
Sep 18, 2009 | September 2009 — The Balver Zinn Group announces that Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from bar solder to SMT solder paste to high-performance fluxes in booth 722 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
FINETECH’s Neil O’Brien to Present at SMTAI 2009
Sep 17, 2009 | FINETECH’s Neil O’Brien will present “Fine-Pitch QFN Rework — Triple the Challenge in a Lead-Free World” at the upcoming SMTA International at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session SMT4, titled “Challenges and Solutions Relating to the Rework of QFN Packages,” on Wednesday, October 7, 2009 from 8-9:30 a.m.
FINETECH to Show FINEVIEW Video Microscope at SMTA Arizona 2009
Aug 04, 2009 | Tempe, AZ - FINETECH will demonstrate the FINEVIEW Video Microscope at the upcoming SMTA Arizona Expo & Tech Forum, on August 26, 2009 at the Fiesta Inn Resort and Conference Center in Tempe, AZ.
Juki to Hold Training Courses in July
Jul 14, 2009 | MORRISVILLE, NC - July 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that Juki Americas will hold two training courses in July.
High Accuracy Die Bonder on display at Semicon West 2009
Jun 23, 2009 | FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.
FINETECH to Present at SMT/HYBRID/PACKAGING
Apr 23, 2009 | FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.
FINETECH to Demonstrate Advanced Rework Applications at APEX 2009
Mar 18, 2009 | FINETECH will demonstrate today's most requested advanced rework applications in booth #2059 at the upcoming APEX 2009, scheduled to take place March 31 � April 2, 2009 at the Mandalay Bay Convention Center in Las Vegas.
FINETECH to Exhibit Direct Component Print Solution at APEX 2009
Mar 10, 2009 | FINETECH will showcase the Direct Component Print Module at APEX 2009 (Booth #2059), scheduled for March 31 � April 2, 2009, at the Mandalay Bay Convention Center in Las Vegas.
FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009
Jan 16, 2009 | FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009
FINETECH Appoints Axiomatek as Exclusive Representative in Mexico
Jan 13, 2009 | FINETECH, a provider of innovative equipment solutions for advanced rework and packaging and assembly applications, announces that Axiomatek will assume sales responsibility for the company's product line in Mexico. Axiomatek is headquartered in Santa Teresa, New Mexico and has multiple offices in Mexico.
FINETECH to Demonstrate Compact Rework System at IPC Midwest 2008
Sep 16, 2008 | Tempe, AZ - FINETECH will exhibit the FINEPLACER� CRS 10 Compact Rework System in booth #809 at IPC Midwest 2008, scheduled for September 24-25, 2008 in Schaumburg, IL.
Scott Kenter Joins FINETECH as Applications Engineer
Sep 02, 2008 | FINETECH announces that Scott Kentner has joined the Manchester, NH team as Applications Engineer.
FINETECH Opens East Coast Applications and Demo Facility
May 29, 2008 | FINETECH, a leading provider of advanced rework and precision bonding equipment, announces the opening of a new facility in Manchester, New Hampshire.
NEPCON China 2008 － FINEPLACER� CRS
Apr 07, 2008 | FINETECH announces that it will display the FINEPLACER� CRS7.MD system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China.
NEPCON China 2008 － FINEVIEW� Asian Premiere
Apr 07, 2008 | FINETECH announces FINEVIEW� video microscope station will make its Asian premiere at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China.
NEPCON China 2008 － FINEPLACER�Lambda
Apr 07, 2008 | FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.
What's happening at FINETECH in 2008?
Mar 25, 2008 | Comment from Neil O�Brien, Director � US Sales
Finetech to Demonstrate Compact Rework System at APEX 2008
Feb 28, 2008 | Tempe, AZ - January 2008 - FINETECH will display the Fineplacer� CRS 10 Compact Rework System in booth #577 at APEX 2008, scheduled for April 1-3, 2008 in Las Vegas.
Laser Bar Bonding with AuSn or Indium on the New Automatic Sub-Micron Bonder FINEPLACER� FEMTO
Nov 27, 2007 | FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.
FINETECH to Present Three World Premieres at Productronica 2007 Tradeshow
Nov 27, 2007 | At the Productronica 2007 tradeshow in Munich, FINETECH, long-time specialist in rework and micro assembly, will present three brand new product solutions.
Bonding Platform FINEPLACER� Micro MA � Accuracy Meets Flexibility
Nov 27, 2007 | FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
FINEPLACER� Application Packages for Advanced Rework � PoP/Underfill/01005/Single Ball
Nov 27, 2007 | FINETECH application packages offered for FINEPLACER� rework systems provide an easy way to enhance the machine�s scope of application. These packages include custom-tailored modules and tools to ensure perfect results for special rework applications.
New LED Lighting Solutions for Vision Alignment and Process Observation.
Nov 01, 2007 | Compared to standard halogen lighting, LED technology provides several benefits, including high-energy efficiency results in significantly reduced heat dissipation. Furthermore, they provide remarkably better luminance values (up to 400 Lumen) and a ten times longer lifespan than with standard halogen, making LED lighting the best choice to meet your rework and micro assembly challenges.
FINETECH to present three world premieres at Productronica 2007 tradeshow
Oct 30, 2007 | At the Productronica 2007 tradeshow in Munich, FINETECH, long-time specialist in rework and micro assembly, will present three brand new product solutions.
New Infrared Start Sensor for Touchless Board Temperature Measurement
Oct 29, 2007 | At the Productronica 2007 tradeshow in Munich, Germany, FINETECH will present a new solution for contactless board temperature measurement � the infrared start sensor.
Finetech to Demonstrate Compact Rework System at Nepcon East 2007
Oct 23, 2007 | Tempe, AZ - October 23, 2007 - FINETECH will demonstrate its fixed configuration, complete rework system, at the upcoming Nepcon East exhibition on October 30-31, 2007 at the Boston Convention Center.
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