News Releases from YINCAE Advanced Materials, LLC.
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55 news releases added by YINCAE Advanced Materials, LLC.
Company Information:
An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates
Jul 28, 2014 | Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
SMT 88UH Fast Cure, Reworkable Underfill
Jul 08, 2014 | YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.
WORLD'S FIRST SUPER FAST LOW TEMPERATURE UNDERFILL
Jun 30, 2014 | YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
YINCAE Advanced Materials LLC has been selected for the 2014 Best of Albany Awards for Manufacturers
Jun 18, 2014 | YINCAE is honored to accept this 2014 Best of Albany Awards for Manufacturers. YINCAE is the leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. It is very rewarding to know that local businesses and customers recognize YINCAE as an outstanding business. YINCAE will continue to serve and please the community as well as the customers. Customer satisfaction is the foundation of our company and YINCAE will continue ensure that every customer is more than satisfied with our product.
NEW ENCAPSULANT PRODUCT SERIES SOLVES THERMOCYCLING ISSUES
Jun 10, 2014 | (Albany, NY) June 10, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new encapsulant products that enable greater production temperature flexibility for microchips with different alloy applications.
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