News Releases from AI Technology, Inc. (AIT)
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10 news releases added by AI Technology, Inc. (AIT)
Company Information:
Temporary Bonding Adhesive for Thin Wafer Handling
Aug 17, 2016 | AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.
AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film
Mar 20, 2015 | THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
AI Technology, Inc (AIT) To Attend and Present Paper at IWLPC. AIT also attending IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference.
Nov 07, 2014 | AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.
AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments
Oct 14, 2014 | AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments. AI Technology (AIT) is proud to present its improved
Prima Protect™ coating line for moisture and salt fog protection.
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications
Sep 05, 2014 | AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption
Jul 28, 2014 | AI Technology is proud to introduce a new generation of Flip-Chip Underfill solution that combines a High Tg of >240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
AI Technology, Inc. (AIT) Releases Cool-Gumpad™ (Thermal Interface Pad) CGP7156
Jun 05, 2014 | AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)
May 07, 2014 | AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
AI Technology, Inc. (AIT) Increases Manufacturing Capacity of Advanced 10 Micron Wafer Level Die-Attach Film (DAF)
Apr 10, 2014 | AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373).
Mar 20, 2014 | COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.
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