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News Releases from MacDermid Alpha Electronics Solutions

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26 news releases added by MacDermid Alpha Electronics Solutions

Company Information:

MacDermid Alpha Electronics Solutions

A materials supplier to the electronics industry. Our breadth of products includes Solder Paste, Solder Preforms, Stencils, Liquid Soldering Flux, Soldering Alloys, Cored Wire, Adhesives, Cleaners and Sinter Technologies

Altoona, Pennsylvania, USA

Manufacturer

  • Phone 8149411694
  • Fax 8149403811

MacDermid Alpha Electronics Solutions website

Company Postings:

(10) products in the catalog

(1) technical library article

(26) news releases

MacDermid Alpha Electronics Solutions to Feature ALPHA HiTech Portfolioat SMTA Empire Expo & Tech Forum

Sep 17, 2021 | The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Empire Expo & Tech Forum on Tuesday, September 28that the RIT Inn & Conference Center in Henrietta, New York.

MacDermid Alpha Presents Solder Paste Solutions for PV Cell Interconnection at EU PVSEC Conference

Sep 02, 2021 | The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper "Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells" at the upcoming virtual European PV Solar Energy Conference and Exhibition which takes place from the 6th-10th September 2021.

MacDermid Alpha Announces Release of MICROFAB® EVF NiBAR Boric Acid Free Electrolytic Nickel

Aug 26, 2021 | MacDermid Alpha Electronics Solutions announces the release of MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications.

MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions at SMTA Ohio Valley Expo& Tech Forum

Aug 18, 2021 | The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will exhibit at the SMTA Ohio Valley Expo& Tech Forumon Wednesday, August 25th at the Holiday Inn in Strongsville, Ohio.

MacDermid Alpha to Present Technical Paper at SMTA China South Technical Conference 2021 in Shenzhen

Aug 13, 2021 | The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: "The Interaction of Two Solder Paste Alloys With 5 Surface Finishes"attheSMTA China South Technical Conference taking place from August 25 - 26 in Shenzhen, China.

MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China

May 21, 2021 | The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.

MacDermid Alpha Launches ALPHA CVP-390V High Reliability Solder Paste for Harsh Operating Conditions

Apr 15, 2021 | MacDermid Alpha Electronics Solutions announces the release of ALPHA CVP-390Vhigh reliability solder paste, designed to maximize flexibility in manufacturing and provide excellent electrochemical reliability in harsh operating conditions.

MacDermid Alpha Receives New Product Innovation Award for ALPHA OM-372 Solder Paste

Apr 13, 2021 | MacDermid Alpha Electronics Solutions was awarded the 2021 Circuits Assembly New Product Innovation Award for ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.

MacDermid Alpha to be a Supporting Partner at the Upcoming IMAPS Device Packaging Conference

Mar 31, 2021 | MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.

MacDermid Alpha Launches New Ultra-Low Temperature Solder Paste capable of Soldering Heat-Sensitive Components

Mar 12, 2021 | MacDermid Alpha Electronics Solutions announces the release of ALPHA OM-220, its latest innovation in low-temperature solder technology.

MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai

Mar 06, 2021 | The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Feb 25, 2021 | MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Announces Release of STAYDRY® H2-3000PSA: Hydrogen & Moisture Getter Film

Jan 30, 2021 | MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Jan 17, 2021 | The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Introduces Innovative Solder Paste Enabling Next Generation High Density Assembly Designs

Dec 18, 2020 | MacDermid Alpha Electronics Solutions is pleased to launch ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.

MacDermid Alpha Releases HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages

Dec 01, 2020 | MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.

MacDermid Alpha to Promote Latest Technology Offerings at the International Electronics Circuit Exhibition

Nov 12, 2020 | MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association.The show will be held from December 2-4, 2020 at the Shenzhen Convention and Exhibition Center,China.

MacDermid Alpha to Present Power Package Attach by Silver Sinteringat PCIM Asia Conference in Shanghai

Nov 06, 2020 | The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Power Package Attach by Silver Sintering – Process, Performance & Reliability" at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.

MacDermid Alpha Releases CircuEtch 200 Anisotropic Final Etch for SAP and mSAP

Nov 03, 2020 | MacDermid Alpha Electronics Solutions announces the release of CircuEtch 200, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.

MacDermid Alpha to Introduce Sintering Products at the Step-by-Step Technical Conference in Hangzhou China

Oct 31, 2020 | The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting an"Introduction to Sintering Products" at the Step-by-Step Technical Conference on Thursday, November 5th, 2020 in Hangzhou, China.

MacDermid Alpha to Present Power Electronics Solutionsat China Powertrain Electrification and Innovation Summit in Shanghai

Oct 16, 2020 | The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Alpha Power Electronics Solutions" at the 3rd China Powertrain Electrification and Innovation Summit 2020 – New Energy Vehicle 2.0 Era from October 22-23, 2020 in Shanghai, China.

MacDermid Alpha to Exhibitat TPCA and Present atIMPACT-EMAP 2020 Conference

Oct 04, 2020 | MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Sep 10, 2020 | MacDermid Alpha Electronics Solutions, a global leader in high performance semiconductor chemistries and assembly materials, will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Sep 06, 2020 | MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

MacDermid Alpha to Present Void Reduction and Silver Free Alloy Solutions at SMTA South China Technology Conference in Shenzhen

Aug 22, 2020 | The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.

MacDermid Alpha Launches Ultra-Low Temperature Solder and 5G Solutions at Productronica China 2020

Jun 24, 2020 | The Assembly Solutions division of MacDermid Alpha Electronics Solutions will be introducing its ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.

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