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News Releases from Johanson technology

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7 news releases added by Johanson technology

Company Information:

A leader in high frequency ceramic components including chip antennas, High Q capacitors and EMI chip filters.

Camarillo, California, USA

Manufacturer

  • Phone (805) 389-1166

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Company Postings:

(7) news releases

Eliminating Latency in Next Gen WiFi 6E Devices

Nov 04, 2020 | Advanced High-Q RF components will play a critical role in larger goal of eliminating many of the latency issues of the past

Eliminating Latency in Next Gen WiFi 6E Devices

Nov 04, 2020 | Advanced High-Q RF components will play a critical role in larger goal of eliminating many of the latency issues of the past

Chipset Specific, Integrated Passive Devices (IPDs) Simplify Development of Next Gen Wireless IoT Applications

Nov 02, 2020 | Miniaturized, front-End IPDs are specifically designed to seamlessly connect with Semtech's LoRa® SX1261, SX1262, and LLCC68 Chipsets

Eliminating Latency in Next Gen WiFi 6E Devices

Aug 03, 2020 | Advanced High-Q RF components will play a critical role in larger goal of eliminating many of the latency issues of the past

Johanson Bandpass Filter for WiFi 6E
Johanson Technology released its first ceramic SMT Bandpass Filter, which has a passband of 5925-7125 MHz while rejecting other interfering bands.

The ‘Relativity’ of High Q Capacitors

Sep 06, 2018 | Although many High Q capacitors are available on the market, performance can vary widely depending on design and quality of manufacturing

Miniaturizing Smart Wearables for Fitness and Activity Tracking

Jul 17, 2018 | Connected, “smart” wearables such as rings, bracelets, clothing and shoes are benefitting from tiny RF chip antennas that take up less PCB space and allow for more miniaturized devices

“A wave of “smart” wearable devices has already entered the market to monitor everything from fitness and health to the physical environment. “

Miniaturized Wireless Medical Wearables

Jul 17, 2018 | Tiny RF chip antennas are no longer relegated to PCB “keep out” area, allowing product designers to further miniaturize wireless biosensors and medical wearables

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