May 21, 2003 soldering using convection ovens or implementing flex circuits and
flex-based packages, two half-day workshops on Thursday during SMTA
International (September 21-25 at the Donald Stephens Convention Center,
Rosemont, IL) will be of special interest.
Creating Reflow Soldering Profiles For Convection Dominant Ovens will be
led by SMTA International conference chair Rob Rowland, RadiSys
Corporation, from 8:30AM - 12:00PM. Topics covered include
time/temperature profiles, oven settings, conveyor speed calculation,
profiling methods, and profiling equipment. Related material topics, such
as flux, solder paste, and moisture sensitive components, will be
covered. Information about oven heaters and conveyor configurations will
also be presented.
Flex Circuits & Flex-Based Packages will be led by SMTA vice president of
technical programs Dr. Ken Gilleo, Cookson Electronics, also from
8:30AM-12:00PM. During the workshop, a summary of flex materials,
processes, constructions, and assembly will be presented from the point of
view that flex was the first and best carrier for solving cost and
high-density problems. Also, the popular new flex-based packages,
including wire-bonded bare die on flex, flip chip-on-flex, TAB, TCP, mBGA,
TBGA, FlexBGA, and others, will be covered.
The workshops above are applications-oriented, present current information,
and review theory and practice on a specific topic. SMTA International
workshops are FREE to all Technical Conference and VIP Conference registrants.
Featuring SMT, Flip Chip, MEMS, Chip Scale, BGA, Automotive, Lead-free,
Process Control and more, SMTA International is dedicated to surface mount,
advanced packaging, and related technologies. For developing information
on SMTA International, visit the on-line conference brochure at
smta.org/smtai or contact SMTA administrator JoAnn Stromberg at
952-920-7682 or joann@smta.org.
http://www.smta.org/smtai/index.cfm
The SMTA membership is a network of professionals who build skills, share
practical experience and develop solutions in electronic assembly
technologies and related business operations.
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