Aug 28, 2021 
Shrinking stencil apertures and gaps between padshave necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on finefeature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.
Increased functionality, higher performance, faster time to market, lower cost, and increasing miniaturization requirements on SiP passives are the driving forces behind the adoption of heterogeneous integration.As stencil apertures shrink below 90µm and gaps between pads fall below 50µm,this solution allows more chips to be integrated into a single package under very tight conditions.
In Applications of FineFeature Solder Paste Printing for Heterogeneous Integration Assembly, Hu will cover Type 6 and Type 7 ultrafine pitch solder paste printing; share SPI data addressing different area ratiosthat explains the influence of powder size, flux vehicle vs. area ratio, and printing performance; and discuss the application of water-soluble paste. He’ll also discuss a related case study and Indium Corporation’s new offering—SiPaste® C201HF, a cleanable paste designed to accommodate fine feature printing.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a master’s degree in IC engineering from the Chinese Academy of Science, and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or emailjhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
SiP Conference China will highlight new advancements in SiP technologies that are helping to implement reduced-size and cost-effective solutions for high data rate wireless 5G technology to cover a wide spectrum of applications, including 5G-NR cellular, IoT, autonomous vehicles, artificial intelligence (AI), data storage, computing, and networking.
SiP Conference China is widely regarded as the most prominent SiP conference in China. This highly informative annual gathering offers the best in electronic system design and SiP packaging expertise from all aspects of the design and supply chain, including assembly and test from OSATs, EMS, OEMs, IDM, and fabless semiconductor companies and silicon foundries, as well as material and equipment suppliers.
