Jan 25, 2001 ViTechnology, LLC introduces the LS-200 for selective soldering and rework of all types of components, from BGAs to large QFPs and even odd-shaped and hybrid devices. This new system is ideal for soldering and desoldering RF shielding and various paste in hole and solder-paste-on-through-hole applications. The LS-200 offers high quality rework with fewer rejects, and a 30% shorter repair time when compared to hot air systems.
The LS-200 is a semiautomatic, off-line rework system that prevents overheating and thermal stress of components, the board, and adjacent components, while at the same time enabling the programming of precise reflow profiles. Handling boards up to 24" X 24". the LS-200 allows exceptional flexibility for Contract Manufacturers. The LS-200 temperature recorder utilizes thermocouples to track temperatures for process development and verification. The Windows NT interface allows customers to link rework information to their entire process. Unlike conventional rework equipment, no tooling changeover is required for different components.
The LS-200 incorporates user-friendly, menu-driven software for programming of cycle time, temperature, shape, scanning frequency, and other parameters. In addition, the process and board tracking system on the LS-200 creates an operator log verifying what boards were processed, by whom, and at what time.
The LS-200 employs a YAG (Yttrium Aluminum Garnet) laser beam, a pyrometer to program and control this proprietary process, and a helium-neon, targeting laser. These tools allow the LS-200 to duplicate exact reflow profiles at uniform and precisely controlled temperatures.
A large convection preheating assembly is utilized to stabilize the board prior to the application of the Laser. The YAG laser beam scans a programmed pattern to transfer heat to the solder joints without potential damage to the adjacent components, traces, or board. Internal device temperatures are more uniform (within 5°C) and similar to typical reflow oven profiles.
The beam can be adjusted from 1.0mm to 4.0mm and can be programmed to follow any given path, including pinpoint, peripheral, and grid array heating. For area array devices, the application of heat remains at a uniform temperature within 2°C.
The pyrometer beam, coupled with the laser, checks and controls the temperature at the impact point every 10 milliseconds. This information is compared with the set point temperature and makes adjustments to the YAG laser beam power. Continuous process monitoring through this closed-loop, thermal regulation system ensures a repeatable and reliable process.
A Helium-Neon beam permits easy visual pre-alignment of the laser before the system is energized. It follows the same optical path as the YAG, which allows the operator to program the exact direction and movement of the invisible YAG laser beam.
Vi TECHNOLOGY is a global supplier, designer and manufacturer of a wide range of innovative inspection equipment and software solutions. The company offer products for a wide range of applications, including PCB assembly, final test and back-end semiconductor production. With 15 years’ experience, Vi TECHNOLOGY offers true added-value with a high-level of technology differentiation to increase electronic manufacturing line efficiency and enhance the final product quality. For more information, visit www.vitechnology.com.
