DEK takes productivity-boosting solutions to SMT/Hybrid/Packaging 2010 in Nuremberg

DEK is preparing to take a whole host of innovative technologies to this year’s SMT/Hybrid/Packaging exhibition, being held in Nuremberg from 8th – 10th June 2010. Stand 7-305 will showcase DEK’s productivity-boosting solutions, from powerful print platforms through to next-generation stencil technologies and Process Improvement Products.

Taking centre stage on DEK Stand 7-305 are the Horizon 01iX and Horizon 03iX print platforms, complete with enhanced quick-access cover packages designed to improve usability and operator management. Fast changeover and 6-Sigma performance are the cornerstones of all of the Horizon iX models, with scalability and easy in-field upgradeability as differentiable advantages of the platform. Customers can determine the Horizon model that best suits their manufacturing requirements today, with the option to add advanced features such as ultra-fast understencil cleaning, automatic board support or dispense capability if and when manufacturing needs change. Visitors can also catch the Horizon 01iX on the Fraunhofer Institute’s live production line running in Hall 6, Stand 430. Demonstrating state-of-the-art production techniques, the platform will utilize advanced technologies including VectorGuard® stencils, Over Top Snuggers substrate clamping, HD Grid-Lok® high density automatic tooling, Cyclone understencil cleaning, HawkEye® print verification and next generation Instinctiv™ V9 user interface.

SMT/Hybrid/Packaging will also enable visitors to view DEK’s new Sentinel platform, a breakthrough print verification and process management technology that lowers the cost of more good printed boards. Combining automatic verification, traceability, real-time process management and inspection capabilities to safeguard and increase productivity at the print platform, Sentinel ensures even greater numbers of qualified good boards per hour moving to downstream assembly processes. Based on DEK’s popular HawkEye® post-print inspection tool, Sentinel delivers 100% inspection capability at the line beat rate, and offers high speed paste on pad, bridge detection and alignment capabilities.

Also on display at Stand 7-305, DEK Productivity Tools on show include Stinger advanced on board dispensing technology and Over Top Snuggers substrate clamping technology. The DEK team will also highlight its latest stencil advance, VectorGuard® Double Layer Platinum. Harnessing the proven advantages of DEK’s VectorGuard stencil tensioning technology, VectorGuard Double Layer Platinum enables fine line printing at < 2 mils or 50 microns and delivers a technology that is more effective than traditional screens for applications such as Low Temperature Co-fired Ceramic (LTCC) and microelectronic packaging. SMT Nuremberg visitors will also be able to witness a live demonstration of DEK’s Process Improvement Products. A dedicated on-stand laboratory will put a wide range of Understencil Cleaning Rolls and Understencil Cleaning Agents to the test, highlighting how DEK technologies boost productivity and yield, reduce risk of defects and minimize rework.

DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com