SMT, PCB Electronics Industry News

ZESTRON Academy to Host Collaborative Cleaning Workshop

May 15, 2017

ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will cohost a free collaborative cleaning and reliability workshop. Aqueous Technologies, Foresite, ITW EAE – Electrovert, ITW EAE – MPM, and ZESTRON will give presentations on “The SMT Process: PCB Build to Reliability Assessment” featuring a live lab demonstration session. The workshop is scheduled for Tuesday, June 20th at the ZESTRON Americas Technical Center located at 11285 Assett Loop, Manassas, Virginia, from 8AM to 4:30PM.

Industry experts will give presentations on building reliability into the SMT process through optimizing printing, reflow, cleaning machines, and cleaning agents to reduce the risk of failure and improve long term reliability. Understanding the sources and why they cause electrical performance and mechanical adhesion problems will be explored.

Live lab demonstrations will provide attendees with an interactive hands-on learning session in small groups featuring the latest in cleaning equipment, ovens, bath monitoring techniques, and cleanliness assessments including ion chromatography (full board and localized) and visual inspection.

Registration is required for this free learning event. Click here to register today.


Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON Americas is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With seven worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.

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