Endicott Interconnect Technologies, Inc. Wins Silicon Valley Contracts

Endicott Interconnect Technologies, Inc. today announced they have been awarded several new contracts for fabrication of wire bond PBGA substrates resulting from alliances with Silicon Valley based companies Singulated Technology and CORWIL Technology Corporation.

EI will provide wire bond PBGA substrates per Singulated Technology�s design specifications and CORWIL Technology Corporation will provide the module assembly. End customers for these semiconductor modules utilize them in military, commercial and wireless electronics applications.

�EI is rapidly becoming our bedrock for fabrication due to their high quality, consistency and capacity to meet exacting qualifications,� stated Darren Maxwell-Davis, President of Singulated Technology. �Moreover, their ability to deliver competitively priced parts, on-time is critical in quick turn applications,� he added.

�This unique approach aligns best-in-class suppliers of substrate design, fabrication and assembly to produce superior finished products for low to mid volume applications where time-to-market is a critical factor in winning the business,� commented James J. McNamara Jr., President and CEO of EI. �The EI team is very excited about the opportunity to partner with industry innovators, Singulated and CORWIL and to provide substrates that add differentiating value,� he continued.

About Singulated Technology

Singulated Technology is a printed circuit substrate design and engineering firm delivering quick-turn chip package (BGA) design, engineering and simulation services. By combining experts in substrate fabrication and assembly with superior CAD tools and top engineering, Singulated Technology offers the quickest turnaround times for the full-spectrum of die implementations. For more information about Singulated Technology, please visit http://www.singulated.com.

About CORWIL Technology Corporation

Founded in 1990, CORWIL is considered the preferred fast turn IC assembly subcontractor by a wide variety of semiconductor and electronics companies, as well as by major military and aerospace corporations. Their customers range from start up companies to the very largest firms designing the latest technology and their processes range from full military specification assembly to high volume wafer dicing and visual inspection. CORWIL has built its reputation by providing excellent quality products and delivering superior service. For more information about CORWIL, please visit http://www.corwil.com.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com

Company Contact:

Theresa Taro

Director of Marketing and Communications

Phone: (607) 755-1847

Theresa.Taro@eitny.com