SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008

Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL). Used in the worlds most powerful and advanced optical packet switch, this controller board functions as the intelligence of the switch.

�This complex construction consisted of 36 layers, 36,053 blind vias, 29,246 connections, a total trace length of 1.6 miles and required multiple passes through the plating and drilling processes, highlighting the criticality of registration,� stated James Fuller, VP semiconductor packaging and printed circuit board fabrication. �The largest hurdle was accommodating 40, back-to-back, two sided, compliant pin connections. The board was fabricated as two sub-composites with deep blind vias that once joined, went only half way through the full thickness of the board. Our engineering team provided the necessary depth control for the pin connections by developing a unique process that filled the vias to preserve the holes during lamination and then mechanically drilled the holes afterwards.�

�This opportunity has been among the most challenging board applications EI has undertaken since its inception,� commented James McNamara, president and CEO at EI. �The engineering expertise and manufacturing execution required to satisfactorily build this board is rare in the industry. Collaboration between our Engineering, Manufacturing and R&D teams aided this valued customer in solving a fabrication puzzle, consequently delivering a leading edge, high performance solution.�

The controller board design won in the 19th Annual PCB Technology Leadership Awards, a competition attracting printed circuit board designers from around the world, in the Telecommunications Switches, Network Servers, Base Stations & Computer Mainframes category. It is one of the most complex designs ever developed and was a core component in the OSMOSIS research project on next generation optical packet switch technology in high-performance computing systems.

Sponsored by the U.S. Department of Energy and in cooperation with Corning Inc., IBM�s computer scientists developed a method of using optical switch elements to transfer packet data throughout the system using light. This novel switch is capable of transmitting 2.5 Terabits of data, which is equivalent to 20 high definition movies, in only 1 second. One of many potential uses for such a system is the acceleration of discoveries in the fields of biomedicine and biology.

Dec 03, 2010 -

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Jul 08, 2008 -

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jun 19, 2008 -

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

May 12, 2008 -

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 -

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 -

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

Nov 08, 2007 -

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

15 more news from i3 Electronics »

Jul 06, 2022 -

Offline PCBA Cleaning Machine HJS-7100,rosin flux, non-clean flux,water-soluble flux cleaning machine

Jul 05, 2022 -

Semiconductor Spray Cleaning Machine HJS-9700,Semiconductor Wafer Cleaning Machine HJS-9700

Jul 04, 2022 -

Pneumatic Stencil Cleaner HJS-9000II,dual chamber stencil cleaning machine

Jul 03, 2022 -

Electric Stencil Cleaner HJS-9500, SMT Electric Stencil Cleaner HJS-9500

Jul 01, 2022 -

Screen Cleaning Machine HJS-4600, SMT Screen Cleaning Machine HJS-4600

Jun 30, 2022 -

Electric Fixture Cleaning Machine HJS-6700, SMT pallet cleaning machine, soldering pallet cleaning machine

Jun 29, 2022 -

Waste Water Treatment Machine RWT-1000, SMT Waste Water Treatment Machine RWT-1000

Jun 28, 2022 -

Gen3's Dr Chris Hunt, CTO submits an insightful paper to the journal of Surface Mount Technology

Jun 28, 2022 -

Squeegee Cleaning Machine HJS-3700,SMT Squeegee Cleaning Machine HJS-3700

Jun 27, 2022 -

Solderstar Celebrates 20 Years of Innovation

See electronics manufacturing industry news »

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board news release has been viewed 722 times

  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board
IPC Training & Certification - Blackfox

ICT Total SMT line Provider