Sep 25, 2019 
CyberOptics® Corporation will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019. The company will demonstrate the MRS-Enabled 3D SQ3000 with multi-process capabilities including 3D AOI, SPI and CMM applications in Booth #110.
Deemed best-in-class, the SQ3000has been widely used for 3D Automated Optical Inspection (AOI) and can be used for 3D Solder Paste Inspection (SPI) for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits.
The SQ3000 can be used to attain highly accurate coordinate measurements faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours. Additionally, the world’s first in-line CMM includes a comprehensive software suite for use in SMT, semiconductor and metrology applications.
The SQ3000 offers a combination of unmatched accuracy and speed with the industry-leading Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects reflections caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for highly accurate measurement, making the proprietary MRS technology an ideal solution for a wide range of applications with exacting requirements.
For more information, visit www.cyberoptics.com.
CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in SMT, semiconductor and metrology markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
Statements regarding the company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled AOI systems; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics and semiconductor markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 3D CMM system, products for semiconductor mid-end and advanced packaging inspection applications and CyberGage360 product; costly and time consuming litigation with third parties related to intellectual property infringement; and other factors set forth in the company’s filings with the Securities and Exchange Commission.
