Mar 13, 2001 The Exhibition Hall of IMAPS 2001, The 34th International Symposium on Microelectronics, is 80% sold out, according to John Graves, General Chair of the symposium. "We are well ahead of our goal for this time, and have even outstripped our progress for last year" he stated. "We're excited, because it's going to be a terrific show and symposium, with more than 350 exhibitor booths and a cutting-edge technical conference." IMAPS 2001 takes place this coming October 9 - 11, 2001 at the Baltimore Convention Center, Baltimore, MD USA.
This popular annual trade exposition and world-renowned prestigious technical conference is expected to draw more than 5,000 of the industry's leading engineers, technicians, purchasers, suppliers, marketers, and management professionals to address an array of issues ranging from Chip Scale packaging to Chip and Wire, from Column Grid Arrays to Flip Chip and Chip on Flex, and will bring to the forefront the key issues in digital and wireless analog packaging for higher frequencies and power, improved speed, greater density, optimum reliability, easier testing and high volume manufacturing.
Sponsored by the International Microelectronics And Packaging Society (IMAPS), the Technical Sessions will feature presentations from leading industry experts on key electronics manufacturing issues. Mr. Graves stated, "We are very pleased at the high booth space sales rate for MAPS '01. The excellent show in Boston last Fall really gave us a boost in marketing the show this year. Everyone knows that Baltimore is a great venue for our annual International Symposium and Exhibition. So, I encourage everyone who wants to exhibit at IMAPS '01 to register now before the Exhibition Hall is completely sold out."
Building on the success and relevance of IMAPS 2000, this coming year's symposium promises to be the best yet. IMAPS 2001 offers a powerful technical program, progressive professional development courses, and many forums for industry professionals to share the latest developments in microelectronics.
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers 69 chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia. Under its 4-tier technical model, IMAPS produces numerous publications, workshops, and international conferences and exhibitions that address everything in electronics between the chip and the system.
