Jan 21, 2009 SN100C P800 D2 is a high-reliability paste for device assembly that reduces voiding and reflow time. With SN100C P800, reflow cycle times are shortened and wettability is increased. The paste has excellent high-speed printability, even for large apertures.
Furthmore, this lead-free paste prevents shrinkage cavities and IMC growth, with no shrinkage defects. This results in a cost-effective, compliant alloy, with high-impact strength.
For more information on the SN100C P800 lead-free solder paste, visit http://www.nihonsuperior.co.jp.
About Nihon Superior Co. Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.
