SMT, PCB Electronics Industry News

PVA Receives Patent for New Optical Bonding Method

Jun 02, 2022

PVA is pleased to announce that it received a new patent in Japan for “optical bonding machine having cure in place and visual feedback.” The new patent is based upon a machine and method designed specifically for applying a UV cure liquid optically clear adhesive used for bonding cover glass and/or sensors to touchscreens used most commonly in automotive, aerospace, military and medical applications.  Key features covered by the patent are related to machine design and methods used.  

This method integrates UV curing into the machine to bond the assembly without having to transfer to another station and risk causing defects. It uses a clear datum to hold the base substrate and a robotic placement head to perform the assembly.

Additionally, this method includes video display of the dispensing and assembly process. Video/image inspection of the bonded assembly shows defects such as bubbles, voids, dust, foreign particles, scratches, etc.

PVA is a world-class innovator of high quality, repeatable dispensing and conformal coating systems. The company manufactures turnkey solutions that help customers improve their competitiveness, such as coating inspection, optical bonding and curing ovens.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.


PVA’s customer driven solutions are utilized worldwide in applications for printed circuit assembly, semiconductor packaging, medical device manufacturing, telecommunications, solar, and consumer electronics. Throughout the changing global manufacturing landscape, from laboratory applications to advance production systems, PVA provides technologies that deliver unmatched precision and reliability.

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