MacDermid Alpha Electronics Solutions announces the release of ALPHA CVP-390Vhigh reliability solder paste, designed to maximize flexibility in manufacturing and provide excellent electrochemical reliability in harsh operating conditions.
ALPHA CVP-390V is a next generation broad latitude chemistry that delivers consistent print and reflow performance across a wide range of component types and feature sizes.ALPHA CVP-390V exhibits best-in-class electrochemical reliability down to 0.100mm comb spacing against the most challenging automotive SIR profiles. The compatibility with the Innolot alloy and ability to maintain high electrochemical performance in harsh operating conditions on dense assembly designs makes ALPHA CVP-390V ideal for high reliability applications.
“ALPHA CVP-390V represents the continual evolution of our industry leading solder paste portfolio to ensure superior performance and reliability on complex PCB assemblies, comments Paul Salerno, Global Portfolio Manager, SMT at MacDermid Alpha. “Assemblies requiring flexibility across multiple component types and assemblies requiring fine feature printability and increasedmanufacturing throughput can also benefit from ALPHA CVP-390V.”
For more informationon ALPHA CVP-390V solder paste please visit MacDermidAlpha.com.
Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.