SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

Sep 12, 2011

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging.

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging.

FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition, scheduled to take place October 11-13, 2011 at the Long Beach Convention Center in Long Beach, CA.

The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 µm). This versatile system can be used for precise placement, die-attach and advanced packaging using various bonding technologies - soldering (eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, gold/tin laser bar bonding, adhesives and UV curing.  Options are available for inert atmosphere and forming gas.

Applications include flip chip, 3-D packaging, MEMS, wafe-level packaging (C2W), optoelectronic and micro optics bonding and assembly, sensors and more. 


Finetech is a leading manufacturer of innovative rework and advanced packaging and assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. Finetech is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.

Jan 14, 2019 -

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

77 more news from Finetech »

Jul 06, 2022 -

Offline PCBA Cleaning Machine HJS-7100,rosin flux, non-clean flux,water-soluble flux cleaning machine

Jul 05, 2022 -

Semiconductor Spray Cleaning Machine HJS-9700,Semiconductor Wafer Cleaning Machine HJS-9700

Jul 04, 2022 -

Pneumatic Stencil Cleaner HJS-9000II,dual chamber stencil cleaning machine

Jul 03, 2022 -

Electric Stencil Cleaner HJS-9500, SMT Electric Stencil Cleaner HJS-9500

Jul 01, 2022 -

Screen Cleaning Machine HJS-4600, SMT Screen Cleaning Machine HJS-4600

Jun 30, 2022 -

Electric Fixture Cleaning Machine HJS-6700, SMT pallet cleaning machine, soldering pallet cleaning machine

Jun 29, 2022 -

Waste Water Treatment Machine RWT-1000, SMT Waste Water Treatment Machine RWT-1000

Jun 28, 2022 -

Gen3's Dr Chris Hunt, CTO submits an insightful paper to the journal of Surface Mount Technology

Jun 28, 2022 -

Squeegee Cleaning Machine HJS-3700,SMT Squeegee Cleaning Machine HJS-3700

Jun 27, 2022 -

Solderstar Celebrates 20 Years of Innovation

See electronics manufacturing industry news »

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach news release has been viewed 842 times

  • SMTnet
  • »
  • Industry News
  • »
  • FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach
ICT Total SMT line Provider

Comprehensive Analytical Services and Support