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Finetech Wins Respected Global Technology Award for Its FINEPLACER® matrix ma Bonder

Nov 20, 2011

FINEPLACER® matrix ma - Semi-Automatic Bonder

FINEPLACER® matrix ma - Semi-Automatic Bonder

Finetech announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its FINEPLACER® matrix ma. The award was presented to the company during a November 15, 2011 ceremony that took place at the New Munich Trade Fair Centre in Munich, Germany during Productronica 2011.

The FINEPLACER® matrix ma is the ideal choice for bonding when high precision and application flexibility are required -- especially when standards of process reliability and reproducibility of results are demanded (specifications such as those found in medical technology, aerospace and the automobile industry).  The process flexibility makes the system ready for future developments in respect to new connection technologies.

Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with a large working area and high placement accuracy, combines application modularity within an open hardware and software environment.  The machine’s small footprint and low power consumption result in an environmentally friendly bonding solution.

Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.


Finetech is a leading manufacturer of equipment for manual and fully automatic circuit board repair and high-precision insertion of electronic/optical components, plus assembly and fitting of complex opto-electronic systems.

Finetech's customers include companies in the aerospace, automobile, medical/bio/solar technology, optoelectronics, semiconductor, consumer electronics and defence sectors, together with education and research establishments. Finetech responds flexibly to specific requirements and offers tailor-made solutions to highly-demanding customer applications. Finetech is represented by direct subsidiaries in its core markets and offers on-site application support and advice.  It is also represented world-wide by a network of agencies.
The headquarters of Finetech are located in Berlin, with subsidiaries in Tempe (AZ), Shanghai and Penang / Malaysia.

As of January 1, 2010, Finetech broadened their mid-range price rework product range by acquiring German rework and dispense specialist MARTIN GmbH of Wessling near Munich.

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Jan 16, 2013 -

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Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

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