SMT, PCB Electronics Industry News

TMV the Second Generation of PoP

Jan 19, 2013

TMV Shorts on Bob Willis Tests using DAGE X-Ray

TMV Shorts on Bob Willis Tests using DAGE X-Ray

Package on Package Assembly Inspection & Quality Control is the first text book covering every step in this exciting manufacturing and design lead technology. Recent trials on the use of TMV are covered along with experiments on the ability to clean these packages and conformal coat. This book is the second publication written by Bob Willis as a free download, his first on Pin In Hole Intrusive Reflow has been read by over 3000 engineers worldwide.

Further details and content of this eBook can be obtained from its dedicated website http://www.packageonpackagebook.com

Package On Package will be launched at IPC APEX Expo, San Diego with pre-registration now at http://PackageOnPackagebook.com

The book contains over 100 pages, 16 sections, diagrams, colour images and x-rays

Join Bob and the NPL Team on the Cleaning and Contamination Testing Center stand 1549 at APEX or on one of his workshops in San Diego

Nov 05, 2021 -

Robotic Soldering Success & Low Temperature Assembly & Inspection

Apr 05, 2021 -

Your Process Defect Solved with Bob Willis

Jan 22, 2021 -

Bob Willis Soldering Workshops Back at IPC APEX

Nov 14, 2020 -

Bob Willis 2021 Online Webinars Launched

Oct 02, 2020 -

Robotic Soldering - How to Benefit

Sep 01, 2020 -

Robotic Soldering Experience with Bob Willis

Jul 02, 2020 -

A picture is worth a thousand words, a video is worth 1,000,000

Jun 02, 2020 -

Solder Preform World – Not New Technology but Very Interesting Option - Bob Willis Charity Webinar

Apr 03, 2020 -

Invite Your Customers to FREE Technical Webinars with Bob Willis

Apr 01, 2020 -

Charity Webinar on Void Formation in Solder Joints - Causes & Cures FREE

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Flux-Free Reflow Soldering

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