Oct 22, 2014 
ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry, is pleased to announce that Jigar Patel, M.S.Chem.Eng., Senior Process Engineer, ZESTRON, will present “Determine Critical Process Parameters for QFNs” at the SMTA Intermountain Expo and Tech Forum. This expo will be held on October 23rd, 2014, at the University of Utah from 10:00 AM to 3:00 PM.
As one of the fastest growing QFN package types within the electronics industry, Bottom Termination Components connect integrated circuits to printed circuit boards. However, the leads are located underneath the component body thereby inhibiting cleaning after the soldering process. Learn how to define and validate the optimal cleaning process parameters for Bottom Termination Components.
For more information on ZESTRON’s complete product line, process solutions and services as well as our final webinar of 2014, “Concentration Monitoring and Control Techniques” on October 23rd, please visit our tabletop exhibit. Our sales and engineering team stand ready to answer any questions you may have.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
»
