Jan 19, 2015 
The Balver Zinn Group announces that Cobar Solder Products Inc. will highlight the Bi Rework Solder Paste (de-soldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The de-soldering paste has been designed for de-soldering Pb-free components and is ideal for LED removal.
The new RoHS compliant paste reduces the risk of board damage during the de-soldering process. With a de-soldering temperature of 180°C, Bi ReworkSolder Paste reduces de-soldering temperatures and times. The no-clean, halide free flux features easy dispensing and clean-up. Additionally, it provides excellent removal of through hole and SMT components.
Representatives from Cobar also will highlight the unique and highly regarded Balver Zinn SN100C® lead-free product range with Balver Zinn SN100CS+® as a new variant with 250ppm instead of the standard 50ppm Ge. Germanium is an anti-oxidant that will react metal oxides on the surface of the solder to reduce dross formation.
Cobar Solder Products Inc. is the U.S. division of the Balver Zinn group.
In addition to the new Bi Rework Solder Paste, Balver Zinn and Cobar offer a complete range of solder bar, solder wire, solder flux, gel flux, cleaner and solder paste. For information about the company’s complete range of solder materials, check out the new mobile Web site at www.balverzinn.com or www.cobar.com.
