Dec 08, 2018 
Ball Grid Array (BGA) Package
http://www.flason-smt.com/new/Ball-Grid-Array-BGA-Package.htmlBall Grid Array or BGA is a surface-mount package (with no leads) utilizing an array of metal spheres (solder balls) for electrical interconnection. BGA solder balls are attached to a laminated substrate at the bottom of the package. The die of the BGA is connected to the substrate by wire bonding or flip-chip technology. The BGA substrate has internal conductive traces that route and connect the die-to-substrate bonds to the substrate-to-ball array bonds.
BGA is soldered on to the Printed Circuit Board using a reflow oven. As the solder balls melts in the reflow oven, the surface tension of the molten solder ball keeps the package aligned in its proper location on the circuit board, until the solder cools and solidifies. Proper and controlled soldering process and temperature is essential for good solder joints and to prevent solder balls from shorting with each other.
A BGA Package
Advantages of Ball Grid Array (BGA) Packaging
- Ball Grid Array (BGA) offers several advantages over other electronic components. The most important advantage of BGA packaging for integrated circuits is its high interconnection density. BGA packages also lesser space on the circuit board.
- Assembly of Ball Grid Array onto circuit boards is more efficient and manageable than its leaded counterparts because the solder needed for soldering the package onto the circuit board come from the solder balls itself. These solder balls also ‘self-align’ themselves during mounting
- Lower thermal resistance between BGA Package and the circuit board is another advantage of Ball Grid Array packaging. This allows heat to flow more freely resulting in better heat dissipation and prevents the device from overheating.
- BGA also offers better electrical conductivity because of shorter path between the die and the circuit board.
Disadvantages of BGA
Like all other electronic packages, BGA too, have some drawbacks. Following are some of the disadvantages of BGA:
- BGA packages are more prone to stress because of flexural stress from the circuit board leading to potential reliability issues.
- Inspecting of solder balls and solder joints for defects is very difficult once the BGA has been soldered onto the circuit board.
Plastic Ball Grid Array (PBGA)
Plastic Ball Grid Array (PBGA) is a type of BGA with a plastic-molded or glob-top body. Size of PBGA packages range from 7 to 50 mm and has ball pitches of 1.00, 1.27, and 1.50 mm. PBGA pin counts range from 16 to 2401 pins. PBGA substrates are laminated and are made of glass-reinforced organic material with excellent thermal properties. Etched copper foils form the conductive traces within the substrate.
Assembly of Plastic Ball Grid Array (PBGA) is normally done by “per substrate strip” where each strip holds several package sites.
Flason Electronic Co.,ltd provide a full smt assembly line solutions, including Lead free reflow oven, wave soldering machine, SMT pick and place machine, smt stencil printer, PCB conveyor manufacturer, PCB unloader, chip mounter, SMT AOI machine, SMT SPI machine, SMT X-Ray machine, SMT assembly line equipment, PCB production Equipment smt spare parts etc any kind SMT machines you may need, please contact us for more information: wechat whatsapp:008613691605420, Skype: flasonsmt, Email: sales@flason-smt.com
FAQ
1) This is the first time I use this kind of machine, is it easy to operate?
There is English manual or guide video that show you how to use machine.
If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.
2) If machine have any problem after I receive it, how can I do ?
Free parts send to you in machine warranty period.
If the part is less than 0.5KG, we pay the postage.
If it exceeds 0.5KG, you need to pay the postage.
3) MOQ ?
1 set machine, mixed order is also welcomed.
4) How can I buy this machine from you? ( Very easy and flexible !)
A. Consult us about this product on line or by e-mail.
B. Negotiate and confirm the final price , shipping , payment methods and other terms.
C. Send you the proforma invoice and confirm your order.
D. Make the payment according to the method put on proforma invoice.
E. We prepare for your order in terms of the proforma invoice after confirming your full payment.
And 100% quality check before shipping.
F.Send your order by air or by sea.
5)Why choose us ?
A. Gold supplier on Alibaba !
B. Trade assurance to US$54,000 !
C. Best price & Best shipping & Best service !
Contact information
PREVIOUS：How Electronic / Electrical Circuit WorksNEXT：SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
RELATED NEWS
- Reflow oven provider-Flason
- Lead-free processes propose new requirem
- Nitrogen Protection Reflow Oven
- Mixed process of SMT reflow oven
- Solder Joint Reliability
CATEGORIES
- Company News
- Industry news
LATEST NEWS
- How to Maintain a Reflow Oven?
- How to optimize the reflow profile?
- How the modern solder reflow oven works?
- SMT Defect List
- How to Prevent Solder Ball and Bridging Defects during the S
CONTACT US
Contact: Andrey
Phone: 13691605420
Tel: 0755-85225569
Email: sales@flason-smt.com
Add: Flason Industry park Shajing Town Baoan district shenzhen China 518104
When SMT matter to your business, partner with Flason. Where innovation takes form.
reflow oven lead free reflow oven LED strip reflow oven dual rail reflow oven custom reflow oven China reflow ovenSMT Peripheral Equipment SMT reflow oven
wave soldering machine pick and place machine lead free wave soldering machine custom wave soldering machinecustom pick and place machine SMT Assembly line
SMT Reflow Oven Manufacturer Wave Soldering Mahchine Manufacturer Pick and Place Machine ManufacturerReflow Oven Manufacturer SMT Spare Parts LED Pick and Place Machine
Andrey: sales@flason-smt.com Wechat whatsapp:+86 13691605420
Keywords: Reflow Oven Manufacturer SMT Reflow Oven Manufacturer Wave Soldering Machine Manufacturer SMT Stencil Printer Manufacturer Pick and Place Machine Manufacturer SMT Inspection machine Manufacturer SMT Pick and Place machine Manufacturer SMT Peripheral Equipment Manufacturer SMT Spare Parts Manufacturer SMT Reflow oven SMT AOI Machine Manufacturer Chip Mounter Manufacturer Solder Paste Printers Manufacturer SMT Reflow Oven Manufacturer SMT Feeder Storage Cart Manufacturer Selective soldering machine Manufacturer SMT Nozzle Manufacturer Siemens Feeder SMT Feeder Manufacturer Wave Soldering Machine Manufacturer Lead Free Reflow Oven Manufacturer Selective Wave soldering machine LED strip Reflow Oven Manufacturer Wave Soldering Machine Manufacturer Automatic SMT Stencil Printer Juki RS-1 Pick and Place Machine SMT Peripheral Equipment Manufacturer China wave soldering machine manufacturer Small wave soldeirng machine
For More information,visit US: Reflow Oven Manufacturer or SMT Reflow Oven Manufacturer Wave Soldering Machine Manufacturer SMT Stencil Printer Manufacturer Pick and Place Machine Manufacturer SMT Inspection machine Manufacturer SMT Assembly Line Manufacturer SMT Peripheral Equipment Manufacturer SMT Spare Parts Manufacturer SMT Feeder Manufacturer SMT Nozzle Manufacturer SMT X Ray Machine Feeder storage cart Manufacturer SMT Reflow Oven Manufacturer manufacturer email us: sales@flason-smt.com
