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Universal Releases Placement Platform for Small, Mid-Size Manufacturers

Mar 10, 2003

A Circuits Assembly News Item

As the number of small- to mid-sized circuit board manufacturers increases, so too does the demand for less expensive component placement equipment with fewer options and capabilities than high-end machines. Universal Instruments (Binghamton, NY) announces the release of the Vantis platform, a placement platform introduced to meet the needs of small- to mid-size consumer electronics, audio-visual equipment, personal computer (PC) and peripheral manufacturers.

Built on the same foundation as the company�s flagship GSM Platform, the machine has been streamlined by removing many features required by larger manufacturers. The platform incorporates a single-beam positioning system and supports a limited number of heads, cameras and configurations. The platform offers a choice of 7-spindle high-speed or 4-spindle flexible heads to accommodate a wide component range, as well as Asian language application support, extensive networking capabilities and an intuitive graphical interface.

�The Vantis will allow Universal to compete with existing mid-range equipment, and introduce additional value through our traditional strengths � robust equipment, expertise, service and support � things you seldom get from companies offering just a low price,� said Aaron Saxton, business development manager for mid-range products.

www.uic.com

Copyright 2003, UP Media Group. All rights reserved.

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